Semiconductor device and method of manufacturing the semiconductor device

ABSTRACT

An object is to provide a semiconductor device provided with a thin film transistor having excellent electric characteristics using an oxide semiconductor layer. An In—Sn—O-based oxide semiconductor layer including SiO X  is used for a channel formation region. In order to reduce contact resistance between the In—Sn—O-based oxide semiconductor layer including SiO X  and a wiring layer formed from a metal material having low electric resistance, a source region or drain region is formed between a source electrode layer or drain electrode layer and the In—Sn—O-based oxide semiconductor layer including SiO X . The source region or drain region and a pixel region are formed using an In—Sn—O-based oxide semiconductor layer which does not include SiO X .

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a semiconductor device including anoxide semiconductor, and a method of manufacturing the semiconductordevice.

2. Description of the Related Art

Various metal oxides are used for a variety of applications. Indiumoxide is a well-known material and is used as a transparent electrodematerial which is necessary for liquid crystal displays and the like.

Some metal oxides have semiconductor characteristics. Metal oxideshaving semiconductor characteristics are a kind of compoundsemiconductor. The compound semiconductor is a semiconductor formedusing two or more kinds of atoms bonded together. In general, metaloxides become insulators. However, it is known that metal oxides becomesemiconductors depending on the combination of elements included in themetal oxides.

For example, it is known that tungsten oxide, tin oxide, indium oxide,zinc oxide, and the like are metal oxides which have semiconductorcharacteristics. A thin film transistor in which a transparentsemiconductor layer which is formed using such a metal oxide serves as achannel formation region is disclosed (see Patent Documents 1 to 4 andNon-Patent Document 1).

Further, not only one-element oxides but also multi-element oxides areknown as metal oxides. For example, InGaO₃(ZnO)_(m) (m is a naturalnumber) which is a homologous compound is a known material (seeNon-Patent Documents 2 to 4).

Furthermore, it is confirmed that such an In—Ga—Zn-based oxide isapplicable to a channel layer of a thin film transistor (see PatentDocument 5 and Non-Patent Documents 5 and 6).

REFERENCE Patent Documents

-   [Patent Document 1] Japanese Published Patent Application No.    S60-198861-   [Patent Document 2] Japanese Published Patent Application No.    H8-264794-   [Patent Document 3] Japanese Translation of PCT International    Application No. H11-505377-   [Patent Document 4] Japanese Published Patent Application No.    2000-150900-   [Patent Document 5] Japanese Published Patent Application No.    2004-103957

Non-Patent Documents

-   [Non-Patent Document 1] M. W. Prins, K. O. Grosse-Holz, G.    Muller, J. F. M. Cillessen, J. B. Giesbers, R. P. Weening, and R. M.    Wolf, “A ferroelectric transparent thin-film transistor”, Appl.    Phys. Lett., 17 Jun. 1996, Vol. 68, p. 3650-3652-   [Non-Patent Document 2] M. Nakamura, N. Kimizuka, and T. Mohri, “The    Phase Relations in the In₂O₃—Ga₂ZnO₄—ZnO System at 1350 “C”, J.    Solid State Chem., 1991, Vol. 93, p. 298-315-   [Non-Patent Document 3] N. Kimizuka, M. Isobe, and M. Nakamura,    “Syntheses and Single-Crystal Data of Homologous Compounds,    In₂O₃(ZnO)_(m) (m=3, 4, and 5), InGaO₃(ZnO)₃, and Ga₂O₃(ZnO)_(m)    (m=7, 8, 9, and 16) in the In₂O₃—ZnGa₂O₄—ZnO System”, J. Solid State    Chem., 1995, Vol. 116, p. 170-178-   [Non-Patent Document 4] M. Nakamura, N. Kimizuka, T. Mohri, and M.    Isobe, “Syntheses and crystal structures of new homologous    compounds, indium iron zinc oxides (InFeO₃(ZnO)_(m)) (m:natural    number) and related compounds”, KOTAI BUTSURI(SOLID STATE PHYSICS),    1993, Vol. 28, No. 5, p. 317-327-   [Non-Patent Document 5] K. Nomura, H. Ohta, K. Ueda, T. Kamiya, M.    Hirano, and H. Hosono, “Thin-film transistor fabricated in    single-crystalline transparent oxide semiconductor”, SCIENCE, 2003,    Vol. 300, p. 1269-1272-   [Non-Patent Document 6] K. Nomura, H. Ohta, A. Takagi, T. Kamiya, M.    Hirano, and H. Hosono, “Room-temperature fabrication of transparent    flexible thin-film transistors using amorphous oxide    semiconductors”, NATURE, 2004, Vol. 432, p. 488-492

SUMMARY OF THE INVENTION

An object of one embodiment of the present invention is to provide adisplay device provided with a thin film transistor having excellentelectric characteristics and a pixel electrode layer, using an oxidesemiconductor layer.

In order to obtain an amorphous oxide semiconductor layer, a thin filmtransistor is manufactured in which an In—Sn—O-based oxide semiconductorlayer including silicon oxide or silicon oxynitride is used for asemiconductor layer including a channel formation region. Typically, theIn—Sn—O-based oxide semiconductor layer is formed using an In—Sn—O-basedoxide semiconductor target including SiO₂ at 5 wt % or higher and 50 wt% or lower, or preferably at 10 wt % or higher and 30 wt % or lower toinclude SiO_(X) (X>0) which interrupts crystallization, so that the thinfilm transistor is obtained, whose gate threshold voltage at which achannel is formed is positive and as close to 0V as possible.

Computation relating to electrical characteristics of a thin filmtransistor in which an In—Sn—O-based oxide semiconductor layer includingSiO_(X) was used as a semiconductor layer including a channel formationregion was performed. A model of the computation and computation resultsare described below.

The computation was performed using Atlas produced by Silvaco DataSystems, Inc. The structure of a model of the computation is such aninverted staggered thin film transistor as illustrated in FIG. 35. Agate insulating layer 802 over a gate electrode layer 801 (the workfunction is 4.7 eV) is formed from a silicon oxynitride layer (thethickness is 100 nm and the relative permittivity is 4.1), asemiconductor layer 803 including a channel formation region is formedfrom an In—Sn—O-based oxide semiconductor layer (the thickness is 50 nmand the electron affinity is 4.3 eV), wiring layers 804 a and 804 b areformed from an In—Sn—O-based oxide semiconductor layer (the workfunction is 4.7 eV), and each of the channel length and the channelwidth in the channel direction of the semiconductor layer 803 includingthe channel formation region is 10 μm, and the mobility of an electronand the mobility of a hole are 0.1 cm²/Vs and 0.01 cm²/Vs, respectively.

The conductivity of the semiconductor layer 803 is, as shown in FIG. 32,computed from a donor (carrier) concentration, and the electriccharacteristics of the thin film transistor are computed in therespective cases where the conductivity is 3.9×10⁻³ S/cm, 1.6×10⁻³ S/cm,8.8×10⁻⁴ S/cm, 1.3×10⁻⁴ S/cm, 1.7×10⁻⁷ S/cm, 1.9×10⁻¹⁰ S/cm, and8.0×10⁻¹² S/cm. Results of computation relating to a voltage between agate and a source (Vgs [V]) of the thin film transistor and a currentbetween a drain and the source (Ids/W [A/μm]) thereof are shown in FIGS.33A and 33B. Note that a drain voltage is set to 1 V in FIG. 33A, andthe drain voltage is set to 10 V in FIG. 33B. In FIGS. 33A and 33B, theresults in the case of each conductivity are shown as follows: theresults in the case of 3.9×10⁻³ S/cm are denoted by inverted-triangulardots, those of 1.6×10⁻³ S/cm are denoted by an alternate long and shortdashed line, those of 8.8×10⁻⁴ S/cm are denoted by triangular dots,those of 1.3×10⁻⁴ S/cm are denoted by a dotted line, those of 1.7×10⁻⁷S/cm are denoted by circular dots, those of 1.9×10⁻¹⁰ S/cm are denotedby a solid line, and those of 8.0×10⁻¹² S/cm are denoted by quadrangulardots.

As shown in FIGS. 33A and 33B, when the conductivity of thesemiconductor layer is less than or equal to 1.6×10⁻³ S/cm, switchingcharacteristics as a thin film transistor can be obtained. FIG. 34 showsa relation between the threshold voltage and the conductivity of thethin film transistor. It can be founded, from FIG. 34, that when theconductivity of the semiconductor layer is less than or equal to1.3×10⁻⁴ S/cm, the threshold voltage is less than or equal to 0 Vapproximately, so that the normally-off thin film transistor can beobtained. Therefore, it can be said that in the thin film transistor inwhich the In—Sn—O-based oxide semiconductor layer including SiO_(X) isused for the semiconductor layer including the channel formation region,the conductivity of the semiconductor layer is preferably less than orequal to 1.6×10⁻³ S/cm, or more preferably less than or equal to1.3×10⁻⁴ S/cm.

In addition, in order to reduce contact resistance between theIn—Sn—O-based oxide semiconductor layer including SiO_(X) and a sourceand a drain electrode layers which are formed from a metal materialhaving low electric resistance, a source region and a drain region areformed between the source and the drain electrode layers and theIn—Sn—O-based oxide semiconductor layer including SiO_(X). One of thesource region and the drain region is formed using the same layer as apixel electrode region.

An In—Sn—O-based oxide semiconductor layer which does not includeSiO_(X) is used for the source region, the drain region, and the pixelelectrode region.

As the material of the source electrode layer or drain electrode layer,an element selected from Al, Cr, Ta, Ti, Mo, and W, an alloy containingany of these elements as its component, an alloy containing acombination of any of these elements, or the like is used.

An embodiment disclosed in this specification is a semiconductor deviceincluding a gate electrode layer, a gate insulating layer, a firstIn—Sn—O-based oxide semiconductor layer including SiO_(X), a sourceregion and a drain region which are in contact with the firstIn—Sn—O-based oxide semiconductor layer including SiO_(X), and a pixelelectrode region. In this structure, the source region or the drainregion and the pixel electrode region are formed from one layer that isa second In—Sn—O-based oxide semiconductor layer.

Another embodiment disclosed in this specification is a semiconductordevice including a gate electrode layer over a substrate having aninsulating surface, a gate insulating layer over the gate electrodelayer, a first In—Sn—O-based oxide semiconductor layer including SiO_(X)over the gate insulating layer, a source region and a drain region whichare in contact with the first In—Sn—O-based oxide semiconductor layerincluding SiO_(X), and a pixel electrode region. In this structure, thesource region or the drain region and the pixel electrode region areformed from one layer that is a second In—Sn—O-based oxide semiconductorlayer.

In any of the above structures, conductivity of the first In—Sn—O-basedoxide semiconductor layer including SiO_(X) is less than or equal to1.6×10⁻³ S/cm, or preferably less than or equal to 1.3×10⁻⁴ S/cm. Notethat the first In—Sn—O-based oxide semiconductor layer including SiO_(X)is formed by a sputtering method using an In—Sn—O-based oxidesemiconductor target including SiO₂ at 5 wt % or higher and 50 wt % orlower, or preferably at 10 wt % or higher and 30 wt % or lower.

An embodiment of the present invention, which realizes the abovestructure, is a method of manufacturing a semiconductor device, in whicha gate electrode layer is formed over a substrate having an insulatingsurface, a gate insulating layer is formed over the gate electrodelayer, a first oxide semiconductor layer including SiO_(X) is formedover the gate insulating layer by a sputtering method using a firstIn—Sn—O-based oxide semiconductor target including SiO₂ at 5 wt % orhigher and 50 wt % or lower, a source region, a drain region, and apixel electrode region are formed over the first oxide semiconductorlayer including SiO_(X) by a sputtering method using a secondIn—Sn—O-based oxide semiconductor target, and the source region, thedrain region, and the pixel electrode region are formed from one layerthat is the second In—Sn—O-based oxide semiconductor layer.

There is no limitation on the structure of the thin film transistor, anda bottom-gate thin film transistor or a top-gate transistor can beemployed.

In this specification, a semiconductor device refers to all types ofdevices which can function by using semiconductor characteristics. Anelectro-optical device, a semiconductor circuit, and an electronicdevice are included in the category of all semiconductor devices.

In addition, it is an object of an embodiment of the present inventionto provide a semiconductor device provided with a highly reliable thinfilm transistor in which an oxide semiconductor layer is used.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1A and 1B illustrate a semiconductor device;

FIGS. 2A to 2E illustrate a method of manufacturing the semiconductordevice;

FIGS. 3A and 3B illustrate a semiconductor device;

FIGS. 4A to 4E illustrate a method of manufacturing the semiconductordevice;

FIGS. 5A and 5B illustrate a semiconductor device;

FIGS. 6A to 6E illustrate a method of manufacturing the semiconductordevice;

FIGS. 7A and 7B illustrate a semiconductor device;

FIGS. 8A and 8B illustrate a semiconductor device;

FIGS. 9A and 9B illustrate a semiconductor device;

FIGS. 10A and 10B illustrate a semiconductor device;

FIGS. 11A1 and 11A2 and FIGS. 11B1 and 11B2 illustrate a semiconductordevice;

FIG. 12 illustrates a method of manufacturing a semiconductor device;

FIG. 13 illustrates a semiconductor device;

FIGS. 14A and 14B are block diagrams each illustrating a semiconductordevice;

FIG. 15 illustrates a configuration of a signal line driver circuit;

FIG. 16 is a timing chart illustrating operation of a signal line drivercircuit;

FIG. 17 is a timing chart illustrating operation of a signal line drivercircuit;

FIG. 18 illustrates a configuration of a shift register;

FIG. 19 illustrates a connection structure of a flip-flop illustrated inFIG. 18;

FIG. 20 illustrates a pixel equivalent circuit of a semiconductordevice;

FIGS. 21A to 21C each illustrate a semiconductor device;

FIGS. 22A1 and 22A2 and FIG. 22B illustrate a semiconductor device;

FIG. 23 illustrates a semiconductor device;

FIGS. 24A and 24B illustrate a semiconductor device;

FIGS. 25A and 25B each illustrate an example of a usage pattern of anelectronic paper;

FIG. 26 is an external view of an example of an electronic book reader;

FIG. 27A is an external view of an example of a television device andFIG. 27B is an external view of an example of a digital photo frame;

FIGS. 28A and 28B each illustrate an example of an amusement machine;

FIGS. 29A and 29B each illustrate an example of a mobile phone;

FIG. 30 illustrates a semiconductor device;

FIG. 31 illustrates a semiconductor device;

FIG. 32 is a graph showing results of computation;

FIGS. 33A and 33B are graphs showing results of computation;

FIG. 34 is a graph showing results of computation;

FIG. 35 illustrates a model of the computation; and

FIGS. 36A and 36B each illustrate a target which can be used formanufacturing a semiconductor device.

DETAILED DESCRIPTION OF THE INVENTION

Embodiments are described with reference to the drawings. However, it iseasily understood by those skilled in the art that the modes and detailsherein disclosed can be modified in a variety of ways without departingfrom the scope and the spirit of the present invention. Therefore, thepresent invention is not interpreted as being limited to the descriptionof the embodiments below. In the structures to be given below, the sameportions or portions having similar functions are denoted by the samereference numerals in different drawings, and explanation thereof willnot be repeated.

Embodiment 1

A semiconductor device and a method of manufacturing the semiconductordevice will be described with reference to FIGS. 1A and 1B and FIGS. 2Ato 2E.

FIG. 1A is a plan view of a thin film transistor 470 included in asemiconductor device, and FIG. 1B is a cross-sectional view taken alongline C1-C2 of FIG. 1A. The thin film transistor 470 is an invertedstaggered thin film transistor and includes, over a substrate 400 whichis a substrate having an insulating surface, a gate electrode layer 401,a gate insulating layer 402, an In—Sn—O-based oxide semiconductor layer403 including SiO_(X), an In—Sn—O-based oxide semiconductor layer 404functioning as a source region or a drain region, an In—Sn—O-based oxidesemiconductor layer 408, and a source electrode layer or drain electrodelayer 405. In addition, an insulating film 407 is provided to cover thethin film transistor 470 and be in contact with the In—Sn—O-based oxidesemiconductor layer 403 including SiO_(X).

An In—Sn—O-based oxide semiconductor layer including silicon oxide orsilicon oxynitride is used for the semiconductor layer including achannel formation region. The conductivity of the In—Sn—O-based oxidesemiconductor layer 403 including SiO_(X) is preferably 1.6×10⁻³ S/cm orless, or more preferably 1.3×10⁻⁴ S/cm or less. Note that theIn—Sn—O-based oxide semiconductor layer 403 including SiO_(X) is formedby a sputtering method using an In—Sn—O-based oxide semiconductor targetincluding SiO₂ at 5 wt % or higher and 50 wt % or lower, or preferablyat 10 wt % or higher and 30 wt % or lower.

The In—Sn—O-based oxide semiconductor layer 404 reduces contactresistance. The In—Sn—O-based oxide semiconductor layer 404 is formed asthe source region or drain region located between the source electrodelayer or drain electrode layer 405 formed from a metal material havinglow electric resistance and the In—Sn—O-based oxide semiconductor layer403 including SiO_(X). One of the source region and the drain region isformed with the In—Sn—O-based oxide semiconductor layer 408 which is thesame layer as a pixel electrode region. Therefore, the In—Sn—O-basedoxide semiconductor layer 408 has both functions of the source region orthe drain region and a pixel electrode.

The In—Sn—O-based oxide semiconductor layer 404 and the In—Sn—O-basedoxide semiconductor layer 408 are formed using an In—Sn—O-based oxidesemiconductor layer which does not include SiO_(X). The In—Sn—O-basedoxide semiconductor layer 404 and the In—Sn—O-based oxide semiconductorlayer 408 largely differ from the In—Sn—O-based oxide semiconductorlayer 403 including SiO_(X) in that they do not include Si. TheIn—Sn—O-based oxide semiconductor layer 404 and the In—Sn—O-based oxidesemiconductor layer 408 can have lower resistance (higher conductivity)than the In—Sn—O-based oxide semiconductor layer 403 including SiO_(X).An In—Sn—O-based oxide semiconductor to which nitrogen is added may beused for the source region, the drain region, and the pixel electroderegion. For example, an In—Sn—O-based non-single-crystal film includingnitrogen can be used.

FIGS. 2A to 2E are cross-sectional views illustrating steps ofmanufacturing the thin film transistor 470.

In FIG. 2A, the gate electrode layer 401 is provided over the substrate400 which is a substrate having an insulating surface. An insulatingfilm serving as a base film may be provided between the substrate 400and the gate electrode layer 401. The base film has a function ofpreventing diffusion of an impurity element from the substrate 400, andcan be formed to have a single-layer or stacked-layer structure usingone or more of a silicon nitride film, a silicon oxide film, a siliconnitride oxide film, and a silicon oxynitride film. The gate electrodelayer 401 can be formed with a single-layer or stacked-layer structureusing a metal material such as molybdenum, titanium, chromium, tantalum,tungsten, aluminum, copper, neodymium, or scandium, or an alloy materialwhich includes any of these materials as a main component.

For example, as a two-layer structure of the gate electrode layer 401,the following structures are preferable: a two-layer structure of analuminum layer and a molybdenum layer stacked thereover, a two-layerstructure of a copper layer and a molybdenum layer stacked thereover, atwo-layer structure of a copper layer and a titanium nitride layer or atantalum nitride layer stacked thereover, and a two-layer structure of atitanium nitride layer and a molybdenum layer. As a three-layerstructure, a structure in which a tungsten layer or a tungsten nitridelayer, a layer of an alloy of aluminum and silicon or an alloy ofaluminum and titanium, and a titanium nitride layer or a titanium layerare stacked is preferable.

The gate insulating layer 402 is formed over the gate electrode layer401.

The gate insulating layer 402 can be formed using a silicon oxide layer,a silicon nitride layer, a silicon oxynitride layer, or a siliconnitride oxide layer to have a single-layer or stacked-layer structure bya plasma CVD method, a sputtering method, or the like. Alternatively,the gate insulating layer 402 can be formed using a silicon oxide layerby a CVD method in which an organosilane gas is used. As theorganosilane gas, the following compound containing silicon can be used:tetraethyl orthosilicate tetraethoxysilane (TEOS, chemical formula:Si(OC₂H₅)₄), tetramethylsilane (TMS, chemical formula: Si (CH₃)₄),tetramethylcyclotetrasiloxane (TMCTS), octamethylcyclotetrasiloxane(OMCTS), hexamethyldisilazane (HMDS), triethoxysilane (SiH(OC₂H₅)₃),trisdimethylaminosilane (SiH(N(CH₃)₂)₃), or the like.

An In—Sn—O-based oxide semiconductor film 430 including SiO_(X) and anIn—Sn—O-based oxide semiconductor film 431 are formed in this order overthe gate insulating layer 402. Each of the In—Sn—O-based oxidesemiconductor film 430 including SiO_(X) and the In—Sn—O-based oxidesemiconductor film 431 is processed through a photolithography step soas to be an island-shaped oxide semiconductor layer.

Note that before the In—Sn—O-based oxide semiconductor film 430including SiO_(X) is formed by a sputtering method, dust attached to asurface of the gate insulating layer 402 may be removed by plasmatreatment in which an argon gas is introduced and plasma is generated.

A conductive film 432 is formed over the gate insulating layer 402, theIn—Sn—O-based oxide semiconductor film 430 including SiO_(X), and theIn—Sn—O-based oxide semiconductor film 431 (see FIG. 2C).

As the material of the conductive film 432, there are an elementselected from Al, Cr, Ta, Ti, Mo, and W; an alloy including any of theseelements as its component; an alloy including a combination of any ofthese elements; and the like. Alternatively, an alloy film in which Al(aluminum) and Nd (neodymium) or Sc (scandium) may be used.

The conductive film 432 is etched through an etching step to form thesource electrode layer or drain electrode layer 405 (see FIG. 2C).

A mask 435 is formed over the In—Sn—O-based oxide semiconductor film 431which does not include SiO_(X). The In—Sn—O-based oxide semiconductorfilm 430 including SiO_(X) and the In—Sn—O-based oxide semiconductorfilm 431 are etched using the source electrode layer or drain electrodelayer 405 and the mask 435 to form the In—Sn—O-based oxide semiconductorlayer 403 including SiO_(X), the In—Sn—O-based oxide semiconductor layer404, and the In—Sn—O-based oxide semiconductor layer 408 (see FIG. 2D).Note that the In—Sn—O-based oxide semiconductor layer 403 includingSiO_(X) is partly etched so as to become a semiconductor layer includinga groove (a recessed portion). The In—Sn—O-based oxide semiconductorlayer 404 functions as the source region or the drain region, and theIn—Sn—O-based oxide semiconductor layer 408 functions as the sourceregion or drain region and the pixel electrode.

Through the above process, the inverted staggered thin film transistor470 illustrated in FIG. 2E, in which the In—Sn—O-based oxidesemiconductor layer 403 including SiO_(X) serves as the channelformation region can be manufactured. In addition, the insulating film407 which covers the thin film transistor 470 and is in contact with theIn—Sn—O-based oxide semiconductor layer 403 including SiO_(X) is formedso as not to cover the pixel electrode region of the In—Sn—O-based oxidesemiconductor layer 408.

The insulating film 407 can be formed using a single layer or a stackedlayer of a silicon nitride film, a silicon oxide film, and a siliconoxynitride film, which are/is obtained by a sputtering method or thelike.

Accordingly, a semiconductor device provided with a thin film transistorhaving excellent characteristics and a pixel electrode layer can berealized.

Embodiment 2

In this embodiment, an example of a semiconductor device including thethin film transistor of Embodiment 1 which is provided with a channelprotective layer will be described with reference to FIGS. 3A and 3B andFIGS. 4A to 4E. Therefore, the other parts can be made in a similarmanner to Embodiment 1, and the same parts or parts having similarfunctions, or steps for making such parts are not repeatedly described.

FIG. 3A is a plan view of a thin film transistor 471 included in asemiconductor device, and FIG. 3B is a cross-sectional view taken alongline Z1-Z2 of FIG. 3A. The thin film transistor 471 is an invertedstaggered thin film transistor and includes, over a substrate 400 whichis a substrate having an insulating surface, a gate electrode layer 401,a gate insulating layer 402, an In—Sn—O-based oxide semiconductor layer403 including SiO_(X), a channel protective layer 409, an In—Sn—O-basedoxide semiconductor layer 404 functioning as a source region or a drainregion, an In—Sn—O-based oxide semiconductor layer 408, and a sourceelectrode layer or drain electrode layer 405. In addition, an insulatingfilm 407 is provided to cover the thin film transistor 471. Theinsulating film 407 is formed so as not to cover the pixel electroderegion of the In—Sn—O-based oxide semiconductor layer 408.

In the thin film transistor 471 in this embodiment, the channelprotective layer 409 is formed over a channel formation region of theIn—Sn—O-based oxide semiconductor layer 403 including SiO_(X). TheIn—Sn—O-based oxide semiconductor layer 403 is not etched because thechannel protective layer 409 functions as a channel stopper.

The channel protective layer 409 can be formed using an inorganicmaterial (such as silicon oxide, silicon nitride, silicon oxynitride,silicon nitride oxide, aluminum oxide, aluminum nitride, aluminumoxynitride, or aluminum nitride oxide). As a formation method, asputtering method can be used.

An In—Sn—O-based oxide semiconductor layer including silicon oxide orsilicon oxynitride is used for a semiconductor layer including a channelformation region. The conductivity of the In—Sn—O-based oxidesemiconductor layer 403 including SiO_(X) is preferably 1.6×10⁻³ S/cm orless, or more preferably 1.3×10⁻⁴ S/cm or less. Note that theIn—Sn—O-based oxide semiconductor layer 403 including SiO_(X) is formedby a sputtering method using an In—Sn—O-based oxide semiconductor targetincluding SiO₂ at 5 wt % or higher and 50 wt % or lower, or preferablyat 10 wt % or higher and 30 wt % or lower.

The In—Sn—O-based oxide semiconductor layer 404 reduces contactresistance. The In—Sn—O-based oxide semiconductor layer 404 is formed asthe source region or drain region between the source electrode layer ora drain electrode layer 405 formed from a metal material having lowelectric resistance and the In—Sn—O-based oxide semiconductor layer 403including SiO_(X). One of the source region and the drain region isformed with the In—Sn—O-based oxide semiconductor layer 408 which is thesame layer as a pixel electrode region. Therefore, the In—Sn—O-basedoxide semiconductor layer 408 has both functions of the source region orthe drain region and a pixel electrode.

The In—Sn—O-based oxide semiconductor layer 404 and the In—Sn—O-basedoxide semiconductor layer 408 are formed using an In—Sn—O-based oxidesemiconductor layer which does not include SiO_(X).

FIGS. 4A to 4E are cross-sectional views illustrating steps ofmanufacturing the thin film transistor 471.

In FIG. 4A, the gate electrode layer 401 is provided over the substrate400 which is a substrate having an insulating surface. An insulatingfilm serving as a base film may be provided between the substrate 400and the gate electrode layer 401.

The gate insulating layer 402 is formed over the gate electrode layer401.

The In—Sn—O-based oxide semiconductor layer 403 including SiO_(X) andthe channel protective layer 409 are formed over the gate insulatinglayer 402. Each of the In—Sn—O-based oxide semiconductor layer 403including SiO_(X) and the channel protective layer 409 is formed througha photolithography step so as to have an island shape.

An In—Sn—O-based oxide semiconductor film 431 and a conductive film 432are formed over the gate insulating layer 402, the In—Sn—O-based oxidesemiconductor layer 403 including SiO_(X), and the channel protectivelayer 409 (see FIG. 4B).

The conductive film 432 is etched through an etching step to form thesource electrode layer or drain electrode layer 405 (see FIG. 4C).

A mask 435 is formed over the In—Sn—O-based oxide semiconductor film 431which does not include SiO_(X). The In—Sn—O-based oxide semiconductorfilm 431 is etched using the source electrode layer or drain electrodelayer 405 and the mask 435 to form the In—Sn—O-based oxide semiconductorlayer 404 and the In—Sn—O-based oxide semiconductor layer 408 (see FIG.4D). The In—Sn—O-based oxide semiconductor layer 404 functions as thesource region or the drain region, and the In—Sn—O-based oxidesemiconductor layer 408 functions as the source region or drain regionand the pixel electrode.

Through the above steps, the inverted staggered thin film transistor 470as illustrated in FIG. 4E, in which the In—Sn—O-based oxidesemiconductor layer 403 including SiO_(X) serves as the channelformation region can be manufactured. In addition, the insulating film407 which covers the thin film transistor 470 and is in contact with thechannel protective layer 409 is formed so as not cover the pixelelectrode region of the In—Sn—O-based oxide semiconductor layer 408.

Accordingly, a semiconductor device provided with a thin film transistorhaving excellent characteristics and a pixel electrode layer can berealized.

Embodiment 3

Another example of a semiconductor device and a method of manufacturingthe semiconductor device will be described with reference to FIGS. 5Aand 5B and FIGS. 6A to 6E.

FIG. 5A is a plan view of a thin film transistor 460 included in asemiconductor device, and FIG. 5B is a cross-sectional view taken alongline D1-D2 of FIG. 5A. The thin film transistor 460 is a bottom-gatethin film transistor and includes, over a substrate 400 which is asubstrate having an insulating surface, a gate electrode layer 401, agate insulating layer 402, a source electrode layer or drain electrodelayer 405, an In—Sn—O-based oxide semiconductor layer 404 functioning asa source region or a drain region, an In—Sn—O-based oxide semiconductorlayer 408, and an In—Sn—O-based oxide semiconductor layer 403 includingSiO_(X). In addition, an insulating film 407 is provided to cover thethin film transistor 460 and be in contact with the In—Sn—O-based oxidesemiconductor layer 403 including SiO_(X). The insulating film 407 isformed so as not to cover the pixel electrode region of theIn—Sn—O-based oxide semiconductor layer 408.

In the thin film transistor 460, the gate insulating layer 402 existsthroughout the region including the thin film transistor 460, and thegate electrode layer 401 is provided between the gate insulating layer402 and the substrate 400 which is a substrate having an insulatingsurface. Over the gate insulating layer 402, the source electrode layeror drain electrode layer 405, the In—Sn—O-based oxide semiconductorlayer 404, and the In—Sn—O-based oxide semiconductor layer 408 areprovided. The In—Sn—O-based oxide semiconductor layer 403 includingSiO_(X) is provided over the gate insulating layer 402, the sourceelectrode layer or drain electrode layer 405, the In—Sn—O-based oxidesemiconductor layer 404, and the In—Sn—O-based oxide semiconductor layer408. Although not illustrated, a wiring layer is provided over the gateinsulating layer 402 in addition to the source electrode layer or drainelectrode layer 405. The wiring layer extends to the outside of aperipheral portion of the In—Sn—O-based oxide semiconductor layer 403including SiO_(X).

An In—Sn—O-based oxide semiconductor layer including silicon oxide orsilicon oxynitride is used for a semiconductor layer including a channelformation region. The conductivity of the In—Sn—O-based oxidesemiconductor layer 403 including SiO_(X) is preferably 1.6×10⁻³ S/cm orless, or more preferably 1.3×10⁻⁴ S/cm or less. Note that theIn—Sn—O-based oxide semiconductor layer 403 including SiO_(X) is formedby a sputtering method using an In—Sn—O-based oxide semiconductor targetincluding SiO₂ at 5 wt % or higher and 50 wt % or lower, or preferablyat 10 wt % or higher and 30 wt % or lower.

The In—Sn—O-based oxide semiconductor layer 404 reduces contactresistance. The In—Sn—O-based oxide semiconductor layer 404 is formed asthe source region or drain region between the source electrode layer ora drain electrode layer 405 formed from a metal material having lowelectric resistance and the In—Sn—O-based oxide semiconductor layer 403including SiO_(X). One of the source region and the drain region isformed with the In—Sn—O-based oxide semiconductor layer 408 which is thesame layer as a pixel electrode region. Therefore, the In—Sn—O-basedoxide semiconductor layer 408 has both functions of the source region orthe drain region and a pixel electrode.

The In—Sn—O-based oxide semiconductor layer 404 and the In—Sn—O-basedoxide semiconductor layer 408 are formed using an In—Sn—O-based oxidesemiconductor layer which does not include SiO_(X).

FIGS. 6A to 6E are cross-sectional views illustrating steps ofmanufacturing the thin film transistor 460.

The gate electrode layer 401 is provided over the substrate 400 which isa substrate having an insulating surface. An insulating film serving asa base film may be provided between the substrate 400 and the gateelectrode layer 401.

The gate insulating layer 402 is formed over the gate electrode layer401. Then, the source electrode layer or drain electrode layer 405 isformed over the gate insulating layer 452 (see FIG. 6A).

An In—Sn—O-based oxide semiconductor film is formed and processedthrough a photolithography step to form island-shaped In—Sn—O-basedoxide semiconductor films 451 and 452 (see FIG. 6B).

Next, an In—Sn—O-based oxide semiconductor film 450 including SiO_(X) isformed over the In—Sn—O-based oxide semiconductor films 451 and 452 (seeFIG. 6C).

The In—Sn—O-based oxide semiconductor film 450 including SiO_(X) isprocessed by etching through a photolithography step to form theisland-shaped In—Sn—O-based oxide semiconductor layer 403 includingSiO_(X) (see FIG. 6D). In the etching of the In—Sn—O-based oxidesemiconductor film 450, the In—Sn—O-based oxide semiconductor films 451and 452 are partly etched to be the In—Sn—O-based oxide semiconductorlayer 404 and the In—Sn—O-based oxide semiconductor layer 408.

Through the above process, the inverted staggered thin film transistor460 illustrated in FIG. 6E, in which the In—Sn—O-based oxidesemiconductor layer 403 including SiO_(X) serves as the channelformation region can be manufactured. In addition, the insulating film407 which covers the thin film transistor 460 and is in contact with theIn—Sn—O-based oxide semiconductor layer 403 including SiO_(X) is formedso as not to cover the pixel electrode region of the In—Sn—O-based oxidesemiconductor layer 408.

Accordingly, a semiconductor device provided with a thin film transistorhaving excellent characteristics and a pixel electrode layer can berealized.

Embodiment 4

In this embodiment, an example of a top-gate semiconductor device willbe described with reference to FIGS. 7A and 7B.

FIG. 7A is a top view of a thin film transistor 480 included in asemiconductor device, and FIG. 7B is a cross-sectional view taken alongline X1-X2 of FIG. 7A. The thin film transistor 480 is a top-gate thinfilm transistor and includes, over a substrate 400 which is a substratehaving an insulating surface; a source electrode layer or drainelectrode layer 405; an In—Sn—O-based oxide semiconductor layer 404which functions as a source region or a drain region and is in contactwith the source electrode layer or drain electrode layer 405; anIn—Sn—O-based oxide semiconductor layer 408; an In—Sn—O-based oxidesemiconductor layer 403 including SiO_(X), which is in contact with theIn—Sn—O-based oxide semiconductor layers 404 and 408; a gate insulatinglayer 402; and a gate electrode layer 401. In addition, an insulatingfilm 407 is provided to cover the thin film transistor 480. Theinsulating film 407 and the gate insulating layer 402 are formed so asnot to cover the pixel electrode region of the In—Sn—O-based oxidesemiconductor layer 408.

The thin film transistor 480 has a structure in which the gateinsulating layer 402 is formed over the source electrode layer or drainelectrode layer 405, the In—Sn—O-based oxide semiconductor layers 404and 408, and the In—Sn—O-based oxide semiconductor layer 403 includingSiO_(X), and the gate electrode layer 401 is provided over the gateinsulating layer 402 to overlap with the In—Sn—O-based oxidesemiconductor layers 404 and 408 and the In—Sn—O-based oxidesemiconductor layer 403 including SiO_(X).

An In—Sn—O-based oxide semiconductor layer including silicon oxide orsilicon oxynitride is used for a semiconductor layer including a channelformation region. The conductivity of the In—Sn—O-based oxidesemiconductor layer 403 including SiO_(X) is preferably 1.6×10⁻³ S/cm orless, or more preferably 1.3×10⁻⁴ S/cm or less. Note that theIn—Sn—O-based oxide semiconductor layer 403 including SiO_(X) is formedby a sputtering method using an In—Sn—O-based oxide semiconductor targetincluding SiO₂ at 5 wt % or higher and 50 wt % or lower, or preferablyat 10 wt % or higher and 30 wt % or lower.

The In—Sn—O-based oxide semiconductor layer 404 reduces contactresistance. The In—Sn—O-based oxide semiconductor layer 404 is formed asthe source region or drain region between the source electrode layer ora drain electrode layer 405 formed from a metal material having lowelectric resistance and the In—Sn—O-based oxide semiconductor layer 403including SiO_(X). One of the source region and the drain region isformed with the In—Sn—O-based oxide semiconductor layer 408 which is thesame layer as a pixel electrode region. Therefore, the In—Sn—O-basedoxide semiconductor layer 408 has both functions of the source region orthe drain region and a pixel electrode.

The In—Sn—O-based oxide semiconductor layer 404 and the In—Sn—O-basedoxide semiconductor layer 408 are formed using an In—Sn—O-based oxidesemiconductor layer which does not include SiO_(X).

Accordingly, a semiconductor device provided with a thin film transistorhaving excellent characteristics and a pixel electrode layer can berealized.

Embodiment 5

In this embodiment, another example of a top-gate semiconductor devicewill be described with reference to FIGS. 8A and 8B.

FIG. 8A is a top view of a thin film transistor 481 included in asemiconductor device, and FIG. 8B is a cross-sectional view taken alongline V1-V2 of FIG. 8A. The thin film transistor 481 is a top-gate thinfilm transistor and includes, over a substrate 400 which is a substratehaving an insulating surface, an In—Sn—O-based oxide semiconductor layer403 including SiO_(X), an In—Sn—O-based oxide semiconductor layer 404functioning as a source region or a drain region and an In—Sn—O-basedoxide semiconductor layer 408 which are in contact with theIn—Sn—O-based oxide semiconductor layer 403 including SiO_(X), a sourceelectrode layer or drain electrode layer 405 in contact with theIn—Sn—O-based oxide semiconductor layer 404, a gate insulating layer402, and a gate electrode layer 401. In addition, an insulating film 407is provided to cover the thin film transistor 481. The insulating film407 and the gate insulating layer 402 are formed so as not to cover thepixel electrode region of the In—Sn—O-based oxide semiconductor layer408.

The thin film transistor 481 has a structure in which the gateinsulating layer 402 is formed over the In—Sn—O-based oxidesemiconductor layer 403 including SiO_(X), the In—Sn—O-based oxidesemiconductor layer 404, the In—Sn—O-based oxide semiconductor layer408, and the source electrode layer or drain electrode layer 405, andthe gate electrode layer 401 is provided over the gate insulating layer402 to overlap with the In—Sn—O-based oxide semiconductor layer 403including SiO_(X) and the In—Sn—O-based oxide semiconductor layers 404and 408.

An In—Sn—O-based oxide semiconductor layer including silicon oxide orsilicon oxynitride is used for a semiconductor layer including a channelformation region. The conductivity of the In—Sn—O-based oxidesemiconductor layer 403 including SiO_(X) is preferably 1.6×10⁻³ S/cm orless, or more preferably 1.3×10⁻⁴ S/cm or less. Note that theIn—Sn—O-based oxide semiconductor layer 403 including SiO_(X) is formedby a sputtering method using an In—Sn—O-based oxide semiconductor targetincluding SiO₂ at 5 wt % or higher and 50 wt % or lower, or preferablyat 10 wt % or higher and 30 wt % or lower.

The In—Sn—O-based oxide semiconductor layer 404 reduces contactresistance. The In—Sn—O-based oxide semiconductor layer 404 is formed asthe source region or drain region between the source electrode layer ora drain electrode layer 405 formed from a metal material having lowelectric resistance and the In—Sn—O-based oxide semiconductor layer 403including SiO_(X). One of the source region and the drain region isformed with the In—Sn—O-based oxide semiconductor layer 408 which is thesame layer as a pixel electrode region. Therefore, the In—Sn—O-basedoxide semiconductor layer 408 has both functions of the source region orthe drain region and a pixel electrode.

The In—Sn—O-based oxide semiconductor layer 404 and the In—Sn—O-basedoxide semiconductor layer 408 are formed using an In—Sn—O-based oxidesemiconductor layer which does not include SiO_(X).

Accordingly, a semiconductor device provided with a thin film transistorhaving excellent characteristics and a pixel electrode layer can berealized.

Embodiment 6

FIGS. 9A and 9B and FIGS. 10A and 10B illustrate examples of asemiconductor device in which an In—Sn—O-based oxide semiconductor layerincluding a source region or a drain region and a pixel electrode regionis formed in an opening formed in an insulating layer over a thin filmtransistor.

FIG. 9A is a top view of a thin film transistor 475 included in asemiconductor device, and FIG. 9B is a cross-sectional view taken alongline Y1-Y2 of FIG. 9A. The thin film transistor 475 is an invertedstaggered thin film transistor and includes, over a substrate 400 whichis a substrate having an insulating surface, a gate electrode layer 401,a gate insulating layer 402, an In—Sn—O-based oxide semiconductor layer403 including SiO_(X), a source electrode layer or drain electrode layer405, an In—Sn—O-based oxide semiconductor layers 404 functioning as asource region or a drain region, an insulating layer 410, and anIn—Sn—O-based oxide semiconductor layer 408.

In FIGS. 9A and 9B, the In—Sn—O-based oxide semiconductor layer 408which does not include SiO_(X) and has both functions of the sourceregion or the drain region and a pixel electrode layer is in contactwith the In—Sn—O-based oxide semiconductor layer 403 including SiO_(X)of the thin film transistor 475 at the opening formed in the insulatinglayer 410 and electrically connected thereto.

FIG. 10A is a top view of a thin film transistor 476 included in asemiconductor device, and FIG. 10B is a cross-sectional view taken alongline Y3-Y4 of FIG. 10A. The thin film transistor 476 is an invertedstaggered thin film transistor and includes, over a substrate 400 whichis a substrate having an insulating surface, a gate electrode layer 401,a gate insulating layer 402, an In—Sn—O-based oxide semiconductor layer403 including SiO_(X), an insulating layer 410, a source electrode layeror drain electrode layer 405, an In—Sn—O-based oxide semiconductor layer404 functioning as a source region or a drain region, an In—Sn—O-basedoxide semiconductor layer 408.

In FIGS. 10A and 10B, the In—Sn—O-based oxide semiconductor layers 404functioning as the source region or drain region and the In—Sn—O-basedoxide semiconductor layer 408 which does not include SiO_(X) and servesas the source region or drain region are in contact with theIn—Sn—O-based oxide semiconductor layer 403 including SiO_(X) of thethin film transistor 475 at an opening formed in the insulating layer410, and electrically connected thereto. In addition, the sourceelectrode layer or drain electrode layer 405 is formed over theIn—Sn—O-based oxide semiconductor layer 404. The insulating film 407 isformed so as not to cover the pixel electrode region of theIn—Sn—O-based oxide semiconductor layer 408 which does not includeSiO_(X).

In this manner, the source region, the drain region, and theIn—Sn—O-based oxide semiconductor layer to be the pixel electrode regionmay be formed after the insulating layer functioning as a planarizationinsulating film is formed over the thin film transistor.

As the planarization insulating film, an organic material such aspolyimide, acrylic, benzocyclobutene, polyamide, or epoxy can be used.Other than such organic materials, it is also possible to use alow-dielectric constant material (a low-k material), a siloxane-basedresin, PSG (phosphosilicate glass), BPSG (borophosphosilicate glass), orthe like.

Note that a siloxane-based resin is a resin formed from a siloxane-basedmaterial as a starting material and having the bond of Si—O—Si. Thesiloxane-based resin may include an organic group (for example, an alkylgroup or an aryl group) or a fluoro group as a substituent. The organicgroup may include a fluoro group.

The method for the formation method of the planarization insulating filmis not limited to a particular method and the following method can beused depending on the material of the planarization insulating film: asputtering method, an SOG method, spin coating, dip coating, spraycoating, a droplet discharge method (e.g., an inkjet method, screenprinting, or offset printing), a doctor knife, a roll coater, a curtaincoater, a knife coater, or the like.

In this embodiment, an example of application of the thin filmtransistor described in Embodiment 1 is described; however, thisembodiment is not limited thereto and can be implemented in combinationwith any of the structures described other embodiments.

Accordingly, a semiconductor device provided with a thin film transistorhaving excellent characteristics and a pixel electrode layer can berealized.

Embodiment 7

In this embodiment, an example of a thin film transistor whose width ofa gate electrode is different from that of the transistor of Embodiment1 is described with reference to FIGS. 11A1, 11A2, 11B1, and 11B2, FIG.12, FIG. 13, and FIG. 31.

FIG. 13 is a plan view of a semiconductor device including a thin filmtransistor 170, and FIG. 12 is a cross-sectional view taken along linesA1-A2 and B1-B2 of FIG. 13. The thin film transistor 170 is an invertedstaggered thin film transistor and includes, over a substrate 100 whichis a substrate having an insulating surface, a gate electrode layer 101,a gate insulating layer 102, an In—Sn—O-based oxide semiconductor layer103 including SiO_(X), an In—Sn—O-based oxide semiconductor layer 104functioning as a source region or a drain region, an In—Sn—O-based oxidesemiconductor layer 110, and a source electrode layer or drain electrodelayer 105. In addition, a protective insulating film 107 is provided tocover the thin film transistor 170 and be in contact with theIn—Sn—O-based oxide semiconductor layer 103 including SiO_(X).

An In—Sn—O-based oxide semiconductor layer including silicon oxide orsilicon oxynitride is used for a semiconductor layer including a channelformation region. The conductivity of the In—Sn—O-based oxidesemiconductor layer 103 including SiO_(X) is preferably 1.6×10⁻³ S/cm orless, or more preferably 1.3×10⁻⁴ S/cm or less. Note that theIn—Sn—O-based oxide semiconductor layer 103 including SiO_(X) is formedby a sputtering method using an In—Sn—O-based oxide semiconductor targetincluding SiO₂ at wt % or higher and 50 wt % or lower, or preferably at10 wt % or higher and 30 wt % or lower.

The In—Sn—O-based oxide semiconductor layer 104 reduces contactresistance. The In—Sn—O-based oxide semiconductor layer 104 is formed asthe source region or drain region between the source electrode layer ora drain electrode layer 105 formed from a metal material having lowelectric resistance and the In—Sn—O-based oxide semiconductor layer 103including SiO_(X). One of the source region and the drain region isformed with the In—Sn—O-based oxide semiconductor layer 110 which is thesame layer as a pixel electrode region. Therefore, the In—Sn—O-basedoxide semiconductor layer 110 has both functions of the source region orthe drain region and a pixel electrode.

The In—Sn—O-based oxide semiconductor layer 104 and the In—Sn—O-basedoxide semiconductor layer 110 are formed using an In—Sn—O-based oxidesemiconductor layer which does not include SiO_(X). The In—Sn—O-basedoxide semiconductor layer 104 and the In—Sn—O-based oxide semiconductorlayer 110 largely differ from the In—Sn—O-based oxide semiconductorlayer 103 including SiO_(X) in that they do not include Si. TheIn—Sn—O-based oxide semiconductor layer 104 and the In—Sn—O-based oxidesemiconductor layer 110 can have lower resistance (higher conductivity)than the In—Sn—O-based oxide semiconductor layer 103 including SiO_(X).An In—Sn—O-based oxide semiconductor to which nitrogen is added may beused for the source region, the drain region, and the pixel electroderegion. For example, an In—Sn—O-based non-single-crystal film includingnitrogen can be used.

The thin film transistor 170 functions as a switching element of a pixelportion in the semiconductor device of FIG. 12. An example ofmanufacturing the semiconductor device is described below.

A conductive layer is formed over the substrate 100 having an insulatingsurface. As the substrate 100 having an insulating surface, a glasssubstrate formed of barium borosilicate glass, alumino-borosilicateglass, or the like can be used.

Next, a photolithography step is performed to form a resist mask. Then,unnecessary portions of the conductive layer are removed, so thatwirings and an electrode (a gate wiring including the gate electrodelayer 101, a capacitor wiring 108, and a first terminal 121) are formed.

Each of the gate wiring including the gate electrode layer 101, thecapacitor wiring 108, and the first terminal 121 of a terminal portioncan be formed with a single layer or a stacked layer using a conductivematerial such as metal material selected from titanium (Ti), tantalum(Ta), tungsten (W), molybdenum (Mo), chromium (Cr), neodymium (Nd), andscandium (Sc); or an alloy material including any of these materials asits main component. In addition, aluminum (Al), copper (Cu), or an alloymaterial including any of these materials as its main component may beused.

For example, as a two-layer structure of the gate electrode layer 101,the following structures are preferable: a two-layer structure in whicha molybdenum layer is stacked over an aluminum layer, a two-layerstructure in which a molybdenum layer is stacked over a copper layer, atwo-layer structure in which a titanium nitride layer or a tantalumnitride layer is stacked over a copper layer, and a two-layer structurein which a titanium nitride layer and a molybdenum layer are stacked. Inaddition, a stack-layer in which a copper oxide layer including Ca whichis to be a barrier layer is formed over a copper layer including Ca, astack-layer in which a copper oxide layer including Mg which is to be abarrier layer is formed over a copper layer including Mg, and the likeare also preferable. Further, as a three-layer structure, it ispreferable to stack a tungsten layer or a tungsten nitride layer, analloy of aluminum and silicon or an alloy of aluminum and titanium, anda titanium nitride layer or a titanium layer.

Next, the gate insulating layer 102 is formed over the entire surface ofthe gate electrode layer 101. The gate insulating layer 102 is formed tohave a thickness of 50 nm to 400 nm inclusive by a sputtering method, aPCVD method, or the like.

For example, for the gate insulating layer 102, a silicon oxide filmwith a thickness of 100 nm is formed by a sputtering method. Needless tosay, the gate insulating layer 102 is not limited to such a siliconoxide film, and other insulating films such as a silicon oxynitridefilm, a silicon nitride film, an aluminum oxide film, an aluminumnitride film, an aluminum oxynitride film, or a tantalum oxide film maybe used to form a single-layer structure or a stacked-layer structure.In the case of employing a stacked-layer structure, for example, asilicon nitride film may be formed by a PCVD method and then a siliconoxide film may be formed thereover by a sputtering method. When asilicon oxynitride film, a silicon nitride film, or the like is used asthe gate insulating layer 102, an impurity from the glass substrate,sodium for example, can be blocked from diffusing into and entering anoxide semiconductor to be formed thereover later.

Next, an In—Sn—O-based oxide semiconductor film including SiO_(X) isformed over the gate insulating layer 102. The In—Sn—O-based oxidesemiconductor film including SiO_(X) is formed by a sputtering methodusing an In—Sn—O-based oxide semiconductor target including SiO₂ at 5 wt% or higher and 50 wt % or lower, or preferably at 10 wt % or higher and30 wt % or lower. By including SiO_(X) in an In—Sn—O-based oxidesemiconductor, the In—Sn—O-based oxide semiconductor including SiO_(X)easily becomes amorphous in its formation. The In—Sn—O-based oxidesemiconductor film including SiO_(X) is etched using a resist maskformed through a photolithography step to form an In—Sn—O-based oxidesemiconductor layer including SiO_(X). The conductivity of theIn—Sn—O-based oxide semiconductor layer 103 including SiO_(X) ispreferably less than 1.6×10⁻³ S/cm, or more preferably less than1.3×10⁻⁴ S/cm.

Then, an In—Sn—O-based oxide semiconductor film which does not includeSiO_(X) is formed using an In—Sn—O-based oxide semiconductor targetwhich does not include SiO_(X). The In—Sn—O-based oxide semiconductorfilm which does not include SiO_(X) is etched using a resist mask formedthrough a photolithography step to form an In—Sn—O-based oxidesemiconductor layer which does not include SiO_(X).

Examples of a sputtering method include an RF sputtering method in whicha high-frequency power source is used as a sputtering power source, a DCsputtering method, and a pulsed DC sputtering method in which a bias isapplied in a pulsed manner. An RF sputtering method is mainly used inthe case where an insulating film is formed, and a DC sputtering methodis mainly used in the case where a metal film is formed.

In addition, there is also a multi-source sputtering apparatus in whicha plurality of targets of different materials can be set. With themulti-source sputtering apparatus, films of different materials can beformed to be stacked in the same chamber, or a film of plural kinds ofmaterials can be formed by electric discharge at the same time in thesame chamber.

In addition, there are a sputtering apparatus provided with a magnetsystem inside the chamber and used for a magnetron sputtering, and asputtering apparatus used for an ECR sputtering in which plasmagenerated with the use of microwaves is used without using glowdischarge.

Furthermore, as a deposition method by sputtering, there are also areactive sputtering method in which a target substance and a sputteringgas component are chemically reacted with each other during depositionto form a thin compound film thereof, and a bias sputtering in which avoltage is also applied to a substrate during deposition.

An In—Sn—O-based oxide semiconductor layer including SiO₂ and anIn—Sn—O-based oxide semiconductor layer can be formed by a sputteringmethod using an In—Sn—O-based oxide semiconductor target including SiO₂and an In—Sn—O-based oxide semiconductor target. The target is formed byattaching a target material to a bucking plate (a board for attaching atarget thereto). As for the attachment of the target to the buckingplate, the target may be divided and attached to one bucking plate.FIGS. 36A and 36B illustrate examples in which the target is divided andattached (bonded) to one bucking plate.

FIG. 36A illustrates an example in which a target 851 is divided intofour pieces of targets 851 a, 851 b, 851 c, and 851 d and they areattached to a bucking plate 850. FIG. 36B illustrates an example inwhich a target is divided to a larger number of targets, that is, atarget 852 is divided into nine pieces of targets 852 a, 852 b, 852 c,852 d, 852 e, 852 f, 852 g, 852 h, and 852 i. Note that the number ofpieces of targets divided is not limited to the number in the case ofFIG. 36A or FIG. 36B. When the target is divided, warpage of the targetcan be relaxed in the attachment of the target to the bucking plate. Inparticular, when the thin film is formed over a large substrate, suchdivided targets can be suitably used for a target which is upsized inaccordance with the size of the large substrate. Needless to say, onetarget may be attached to one bucking plate.

As the etching, either wet etching or dry etching can be used.

As the dry etching method, a parallel plate RIE (reactive ion etching)method or an ICP (inductively coupled plasma) etching method can beused. In order to etch the films into desired shapes, the etchingcondition (the amount of electric power applied to a coil-shapedelectrode, the amount of electric power applied to an electrode on asubstrate side, the temperature of the electrode on the substrate side,or the like) is adjusted as appropriate.

As an etchant used for wet etching, a solution obtained by mixingphosphoric acid, acetic acid, and nitric acid, an ammonia peroxidemixture (hydrogen peroxide:ammonia:water=5:2:2), or the like can beused. Alternatively, ITO07N (manufactured by Kanto Chemical Co., Inc.)may be used.

Furthermore, the etchant after the wet etching is removed together withthe etched material by cleaning. Waste liquid of the etchant includingthe removed material may be purified to recycle the materials includedin the waste liquid. A material such as indium included in the oxidesemiconductor layer are collected from the waste liquid after theetching and recycled, so that resources can be effectively used and costcan be reduced.

The etching conditions (such as an etchant, etching time, andtemperature) are appropriately adjusted depending on the material sothat the material can be etched into a desired shape.

Next, a photolithography step is performed to form a resist mask, andunnecessary portions (part of the gate insulating layer) are removed byetching, so that a contact hole which is formed from the same materialas the gate electrode layer and reaches the wiring or the electrodelayer is formed. This contact hole is provided for direct contact with aconductive film formed later. For example, in a driver circuit portion,a contact hole is formed in the case where a thin film transistor whosegate electrode layer is direct contact with a source electrode layer ordrain electrode layer or a terminal that is electrically connected to agate wiring of a terminal portion is formed.

Next, the conductive film formed from a metal material is formed by asputtering method or a vacuum evaporation method over the In—Sn—O-basedoxide semiconductor layer including SiO_(X) and the In—Sn—O-based oxidesemiconductor layer which does not include SiO_(X).

As examples of a material of the conductive film, an element selectedfrom Al, Cr, Ta, Ti, Mo, W, Nd, and Sc, an alloy including any of theseelements as its component, an alloy including any of the elements incombination, and the like can be given.

For example, a single-layer structure of a titanium film, a two-layerstructure in which a titanium film is stacked over an aluminum film, orthe like may be employed for the conductive film. Alternatively, theconductive film may have a three-layer structure in which a Ti film, analuminum film including Nd (Al—Nd), and a Ti film are stacked in thisorder. The conductive film may have a single-layer structure of analuminum film including silicon.

Then, a photolithography step is performed to form a resist mask andunnecessary portions are removed by etching to form a conductive layer128 connected to the source electrode layer or drain electrode layer105, a second terminal 122, and the first terminal 121. Note that thesecond terminal 122 is electrically connected to a source wiring (asource wiring including the source electrode layer or drain electrodelayer 105).

A photolithography step is performed to form a resist mask over theIn—Sn—O-based oxide semiconductor layer including SiO_(X). TheIn—Sn—O-based oxide semiconductor layer including SiO_(X) and theIn—Sn—O-based oxide semiconductor layer are etched using the mask toform the In—Sn—O-based oxide semiconductor layer 103 including SiO_(X),the In—Sn—O-based oxide semiconductor layer 104, and the In—Sn—O-basedoxide semiconductor layer 110. Note that only part of the In—Sn—O-basedoxide semiconductor layer 103 including SiO_(X) is etched so that theIn—Sn—O-based oxide semiconductor layer 103 including SiO_(X) has agroove (a recessed portion). The In—Sn—O-based oxide semiconductor layer104 functions as the source region or drain region. The In—Sn—O-basedoxide semiconductor layer 110 functions as the source region or drainregion and the pixel electrode.

Through the above steps, a semiconductor device whose pixel portionincludes the thin film transistor 170 in which the In—Sn—O-based oxidesemiconductor layer 103 including SiO_(X) serves as the channelformation region, and the In—Sn—O-based oxide semiconductor layer servesas the pixel electrode can be manufactured. Note that a top view at thisstage corresponds to FIG. 13.

Further, by use of a resist mask having regions with plural thicknesses(typically, two different thicknesses) which is formed using amulti-tone mask, the number of resist masks can be reduced, resulting insimplified process and lower costs.

Next, the protective insulating layer 107 is formed to cover the thinfilm transistor 170. For the protective insulating layer 107, a siliconnitride film, a silicon oxide film, a silicon oxynitride film, analuminum oxide film, a tantalum oxide film, or the like which isobtained by a sputtering method or the like can be used.

Next, a photolithography step is performed to form a resist mask and theprotective insulating layer 107 is etched, so that a pixel electroderegion of the In—Sn—O-based oxide semiconductor layer 110 is exposed. Inaddition, a contact hole reaching the second terminal 122 and a contacthole reaching the conductive layer 128 are also formed in this etching.

The conductive layer 128 directly connected to the first terminal 121serves as a connection terminal electrode functioning as an inputterminal of the gate wiring. The second terminal 122 is a connectionterminal electrode functioning as an input terminal of the sourcewiring.

FIGS. 11A1 and 11A2 are respectively a cross-sectional view and a topview of a gate wiring terminal portion at this stage. FIG. 11A1corresponds to a cross-sectional view taken along line E1-E2 of FIG.11A2. In FIG. 11A1, a conductive layer 153 which is exposed by removingthe protective insulating film 154 is a connection terminal electrodefunctioning as an input terminal. Furthermore, in the terminal portionof FIG. 11A1, a first terminal 151 formed from the same material as thegate wiring and the conductive layer 153 formed from the same materialas the source wiring are connected to each other and brought intoconduction. Note that the portion illustrated in FIG. 12 where theconductive layer 128 is in contact with the first terminal 121corresponds to a portion illustrated in FIG. 11A1 where the conductivelayer 153 is in contact with the first terminal 151.

FIGS. 11B1 and 11B2 are respectively a cross-sectional view and a topview of a source wiring terminal portion which is different from thatillustrated in FIG. 12C. Moreover, FIG. 11B1 corresponds to across-sectional view taken along line F1-F2 of FIG. 11B2. In FIG. 11B1,the second terminal 150 which is exposed by removing the protectiveinsulating film 154 is a connection terminal electrode functioning as aninput terminal. In the terminal portion of FIG. 11B1, an electrode layer156 formed of the same material as the gate wiring is disposed below thesecond terminal 150 electrically connected to the source wiring, withthe gate insulating layer 152 interposed between the second terminal 150and the electrode layer 156. The electrode layer 156 is not electricallyconnected to the second terminal 150, and a capacitor to prevent noiseor static electricity can be formed when the potential of the electrodelayer 156 is set to a potential different from that of the secondterminal 150, such as floating, GND, or 0 V.

A plurality of gate wirings, source wirings, and capacitor wirings areprovided depending on the pixel density. Also in the terminal portion,the first terminal at the same potential as the gate wiring, the secondterminal at the same potential as the source wiring, the third terminalat the same potential as the capacitor wiring, and the like are eacharranged in plurality. There is no particular limitation on the numberof each of the terminals, and the number of the terminals may bedetermined by a practitioner as appropriate.

In this manner, the pixel portion including the thin film transistor 170that is a bottom-gate n-channel thin film transistor, the pixelelectrode, and a storage capacitor and the terminal portion can becompleted. In addition, a driver circuit can be formed over the samesubstrate. These are arranged in matrix in respective pixels so that apixel portion is formed, which can be used as one of substrates formanufacturing an active matrix display device. In this specification,such a substrate is referred to as an active matrix substrate forconvenience.

When an active matrix liquid crystal display device is manufactured, anactive matrix substrate and a counter substrate provided with a counterelectrode are bonded to each other with a liquid crystal layerinterposed therebetween. Note that a common electrode electricallyconnected to the counter electrode on the counter substrate is providedover the active matrix substrate, and a fourth terminal electricallyconnected to the common electrode is provided in the terminal portion.This fourth terminal is provided so that the common electrode is fixedto a predetermined potential such as GND or 0 V.

The embodiment of the present invention is not limited to the pixelstructure of FIG. 13. An example of the top view having a pixelstructure different from that of FIG. 13 is illustrated in FIG. 31. FIG.31 illustrates an example in which a capacitor wiring is not providedand a storage capacitor is formed with a pixel electrode region and agate wiring of an adjacent pixel which overlap with each other with aprotective insulating film and a gate insulating layer interposedtherebetween. In this case, the capacitor wiring and a third terminalconnected to the capacitor wiring can be omitted. Note that in FIG. 31,portions similar to those in FIG. 13 are denoted by the same referencenumerals.

In an active matrix liquid crystal display device, display patterns areformed on a screen by driving pixel electrodes arranged in a matrix. Inmore detail, when voltage is applied between a selected pixel electrodeand a counter electrode that corresponds to the selected pixelelectrode, a liquid crystal layer provided between the pixel electrodeand the counter electrode is optically modulated, and this opticalmodulation is recognized as a display pattern by an observer.

In displaying moving images, a liquid crystal display device has aproblem that a long response time of liquid crystal molecules themselvescauses afterimages or blurring of moving images. In order to improve themoving-image characteristics of a liquid crystal display device, adriving method called black insertion is employed in which black isdisplayed on the whole screen every other frame period.

Alternatively, a driving method called double-frame rate driving may beemployed in which a vertical synchronizing frequency is 1.5 times ormore, preferably, 2 times or more as high as a usual verticalsynchronizing frequency, whereby the moving-image characteristics areimproved.

Further alternatively, in order to improve the moving-imagecharacteristics of a liquid crystal display device, a driving method maybe employed in which a plurality of LED (light-emitting diode) lightsources or a plurality of EL light sources are used to form a surfacelight source as a backlight, and each light source of the surface lightsource is independently driven in a pulsed manner in one frame period.As the surface light source, three or more kinds of LEDs may be used andan LED emitting white light may be used. Since a plurality of LEDs canbe controlled independently, the light emission timing of LEDs can besynchronized with the timing at which a liquid crystal layer isoptically modulated. According to this driving method, LEDs can bepartly turned off; therefore, an effect of reducing power consumptioncan be obtained particularly in the case of displaying an image having alarge part on which black is displayed.

By combining these driving methods, the display characteristics of aliquid crystal display device, such as moving-image characteristics, canbe improved as compared to those of conventional liquid crystal displaydevices.

The use of the oxide semiconductor for the thin film transistor leads toreduction in manufacturing cost.

This embodiment can be implemented in appropriate combination with anyof the structures described in the other embodiments.

Embodiment 8

An example will be described below, in which at least a part of a drivercircuit and a thin film transistor arranged in a pixel portion areformed over the same substrate in a display device which is one exampleof a semiconductor device.

The thin film transistor arranged in the pixel portion includes anIn—Sn—O-based oxide semiconductor layer including SiO_(X), as asemiconductor layer including a channel formation region; and anIn—Sn—O-based oxide semiconductor layer which does not include SiO_(X),as a source region and a drain region. The thin film transistor arrangedin the pixel portion is formed in accordance with Embodiments 1 to 7.Further, the thin film transistor described in Embodiments 1 to 7 is ann-channel TFT, and thus a part of a driver circuit that can include ann-channel TFT among driver circuits is formed over the same substrate asthe thin film transistor of the pixel portion.

FIG. 14A is an example of a block diagram of an active matrix liquidcrystal display device which is an example of a semiconductor device.The display device illustrated in FIG. 14A includes, over a substrate5300, a pixel portion 5301 including a plurality of pixels that are eachprovided with a display element; a scan line driver circuit 5302 thatselects a pixel; and a signal line driver circuit 5303 that controls avideo signal input to the selected pixel.

In addition, the thin film transistor described in Embodiments 1 to 7 isan n-channel TFT, and a signal line driver circuit including then-channel TFT is described with reference to FIG. 15.

The signal line driver circuit illustrated in FIG. 15 includes a driverIC 5601, switch groups 5602_1 to 5602_M, a first wiring 5611, a secondwiring 5612, a third wiring 5613, and wirings 5621_1 to 5621_M. Each ofthe switch groups 5602_1 to 5602_M includes a first thin film transistor5603 a, a second thin film transistor 5603 b, and a third thin filmtransistor 5603 c.

The driver IC 5601 is connected to the first wiring 5611, the secondwiring 5612, the third wiring 5613, and the wirings 5621_1 to 5621_M.Each of the switch groups 5602_1 to 5602_M is connected to the firstwiring 5611, the second wiring 5612, and the third wiring 5613, and thewirings 5621_1 to 5621_M are connected to the switch groups 5602_1 to5602_M, respectively. Each of the wirings 5621_1 to 5621_M is connectedto three signal lines via the first thin film transistor 5603 a, thesecond thin film transistor 5603 b, and the third thin film transistor5603 c. For example, the wiring 5621_J of the J-th column (one of thewirings 5621_1 to 5621_M) is connected to a signal line Sj−1, a signalline Sj, and a signal line Sj+1 via the first thin film transistor 5603a, the second thin film transistor 5603 b, and the third thin filmtransistor 5603 c, respectively, which are included in the switch group5602_J.

A signal is input to each of the first wiring 5611, the second wiring5612, and the third wiring 5613.

Note that the driver IC 5601 is preferably formed over a single crystalsubstrate. Further, the switch groups 5602_1 to 5602_M are preferablyformed over the same substrate as the pixel portion is. Therefore, thedriver IC 5601 and the switch groups 5602_1 to 5602_M are preferablyconnected through an FPC or the like.

Next, an operation of the signal line driver circuit illustrated in FIG.15 is described with reference to a timing chart in FIG. 16. The timingchart in FIG. 16 illustrates the case where the scan line Gi of the i-throw is selected. A selection period of the scan line Gi of the i-th rowis divided into a first sub-selection period T1, a second sub-selectionperiod T2, and a third sub-selection period T3. In addition, even when ascan line of another row is selected, the signal line driver circuit inFIG. 15 operates in a manner similar to FIG. 16.

Note that the timing chart in FIG. 16 shows the case where the wiring5621_J of the J-th column is connected to the signal line Sj−1, thesignal line Sj, and the signal line Sj+1 via the first thin filmtransistor 5603 a, the second thin film transistor 5603 b, and the thirdthin film transistor 5603 c, respectively.

Note that the timing chart in FIG. 16 shows timing at which the scanline Gi of the i-th row is selected, timing 5703 a of on/off of thefirst thin film transistor 5603 a, timing 5703 b of on/off of the secondthin film transistor 5603 b, timing 5703 c of on/off of the third thinfilm transistor 5603 c, and a signal 5721_J input to the wiring 5621_Jof the J-th column.

In the first sub-selection period T1, the second sub-selection periodT2, and the third sub-selection period T3, different video signals areinput to the wirings 5621_1 to 5621_M. For example, a video signal inputto the wiring 5621_J in the first sub-selection period T1 is input tothe signal line Sj−1, a video signal input to the wiring 5621_J in thesecond sub-selection period T2 is input to the signal line Sj, and avideo signal input to the wiring 5621_J in the third sub-selectionperiod T3 is input to the signal line Sj+1. In addition, the videosignals input to the wiring 5621_J in the first sub-selection period T1,the second sub-selection period T2, and the third sub-selection periodT3 are denoted by Data_j−1, Data_j, and Data_j+1.

As shown in FIG. 16, in the first sub-selection period T1, the firstthin film transistor 5603 a is turned on, and the second thin filmtransistor 5603 b and the third thin film transistor 5603 c are turnedoff. At this time, Data_j−1 input to the wiring 5621_J is input to thesignal line Sj−1 via the first thin film transistor 5603 a. In thesecond sub-selection period T2, the second thin film transistor 5603 bis turned on, and the first thin film transistor 5603 a and the thirdthin film transistor 5603 c are turned off. At this time, Data_j inputto the wiring 5621_J is input to the signal line Sj via the second thinfilm transistor 5603 b. In the third sub-selection period T3, the thirdthin film transistor 5603 c is turned on, and the first thin filmtransistor 5603 a and the second thin film transistor 5603 b are turnedoff. At this time, Data_j+1 input to the wiring 5621_J is input to thesignal line Sj+1 via the third thin film transistor 5603 c.

As described above, in the signal line driver circuit in FIG. 15, bydividing one gate selection period into three, video signals can beinput to three signal lines from one wiring 5621 in one gate selectionperiod. Therefore, in the signal line driver circuit in FIG. 15, thenumber of connections between the substrate provided with the driver IC5601 and the substrate provided with the pixel portion can beapproximately ⅓ of the number of signal lines. The number of connectionsis reduced to approximately ⅓ of the number of the signal lines, so thatreliability, yield, etc., of the signal line driver circuit in FIG. 15can be improved.

Note that there are no particular limitation on the arrangement, thenumber, a driving method, and the like of the thin film transistors, aslong as one gate selection period is divided into a plurality ofsub-selection periods and video signals are input to a plurality ofsignal lines from one wiring in the respective sub-selection periods asshown in FIG. 15.

For example, when video signals are input to three or more signal linesfrom one wiring in three or more sub-selection periods, it is onlynecessary to add a thin film transistor and a wiring for controlling thethin film transistor. Note that when one gate selection period isdivided into four or more sub-selection periods, one sub-selectionperiod becomes shorter. Therefore, one gate selection period ispreferably divided into two or three sub-selection periods.

As another example, one selection period may be divided into a prechargeperiod Tp, the first sub-selection period T1, the second sub-selectionperiod T2, and the third sub-selection period T3 as shown in a timingchart of FIG. 17. The timing chart of FIG. 17 shows the timing at whichthe scan line Gi of the i-th row is selected, timing 5803 a of on/off ofthe first thin film transistor 5603 a, timing 5803 b of on/off of thesecond thin film transistor 5603 b, timing 5803 c of on/off of the thirdthin film transistor 5603 c, and a signal 5821_J input to the wiring5621_J of the J-th column. As shown in FIG. 17, the first thin filmtransistor 5603 a, the second thin film transistor 5603 b, and the thirdthin film transistor 5603 c are tuned on in the precharge period Tp. Atthis time, precharge voltage Vp input to the wiring 5621_J is input tothe signal line Sj−1, the signal line Sj, and the signal line Sj+1 viathe first thin film transistor 5603 a, the second thin film transistor5603 b, and the third thin film transistor 5603 c, respectively. In thefirst sub-selection period T1, the first thin film transistor 5603 a isturned on, and the second thin film transistor 5603 b and the third thinfilm transistor 5603 c are turned off. At this time, Data_j−1 input tothe wiring 5621_J is input to the signal line Sj−1 via the first thinfilm transistor 5603 a. In the second sub-selection period T2, thesecond thin film transistor 5603 b is turned on, and the first thin filmtransistor 5603 a and the third thin film transistor 5603 c are turnedoff. At this time, Data_j input to the wiring 5621_J is input to thesignal line Sj via the second thin film transistor 5603 b. In the thirdsub-selection period T3, the third thin film transistor 5603 c is turnedon, and the first thin film transistor 5603 a and the second thin filmtransistor 5603 b are turned off. At this time, Data_j+1 input to thewiring 5621_J is input to the signal line Sj+1 via the third thin filmtransistor 5603 c.

As described above, in the signal line driver circuit of FIG. 15 towhich the timing chart of FIG. 17 is applied, the video signal can bewritten to the pixel at high speed because the signal line can beprecharged by providing a precharge selection period before asub-selection period. Note that portions of FIG. 17 which are similar tothose of FIG. 16 are denoted by common reference numerals and detaileddescription of like portions and portions having similar functions isomitted.

Further, a structure of a scan line driver circuit is described. Thescan line driver circuit includes a shift register and a buffer.Additionally, the scan line driver circuit may include a level shifter.In the scan line driver circuit, when a clock signal (CLK) and a startpulse signal (SP) are input to the shift register, a selection signal isgenerated. The generated selection signal is buffered and amplified bythe buffer, and the resulting signal is supplied to a corresponding scanline. Gate electrodes of transistors in pixels of one line are connectedto the scan line. Since the transistors in the pixels of one line haveto be turned on all at once, a buffer which can supply a large currentis used.

One mode of a shift register used for a part of the scan line drivercircuit will be described with reference to FIG. 18 and FIG. 19.

FIG. 18 illustrates a circuit structure of the shift register. The shiftregister illustrated in FIG. 18 includes a plurality of flip-flops:flip-flops 5701_1 to 5701_n. The shift register is operated with inputof a first clock signal, a second clock signal, a start pulse signal,and a reset signal.

The connection relationship of the shift register of FIG. 18 will bedescribed. In the i-th stage flip-flop 5701_i (one of the flip-flops5701_1 to 5701_n) in the shift register of FIG. 18, a first wiring 5501shown in FIG. 19 is connected to a seventh wiring 5717_i−1, a secondwiring 5502 shown in FIG. 19 is connected to a seventh wiring 5717_i+1,a third wiring 5503 shown in FIG. 19 is connected to a seventh wiring5717_i, and a sixth wiring 5506 shown in FIG. 19 is connected to a fifthwiring 5715.

Further, a fourth wiring 5504 shown in FIG. 19 is connected to a secondwiring 5712 in flip-flops of odd-numbered stages, and is connected to athird wiring 5713 in flip-flops of even-numbered stages. A fifth wiring5505 shown in FIG. 19 is connected to a fourth wiring 5714.

Note that the first wiring 5501 of the first stage flip-flop 5701_1which is shown in FIG. 19 is connected to a first wiring 5711. Moreover,the second wiring 5502 of the n-th stage flip-flop 5701_n which is shownin FIG. 19 is connected to a sixth wiring 5716.

Note that the first wiring 5711, the second wiring 5712, the thirdwiring 5713, and the sixth wiring 5716 may be referred to as a firstsignal line, a second signal line, a third signal line, and a fourthsignal line, respectively. The fourth wiring 5714 and the fifth wiring5715 may be referred to as a first power source line and a second powersource line, respectively.

Next, FIG. 19 illustrates details of the flip-flop shown in FIG. 18. Aflip-flop shown in FIG. 19 includes a first thin film transistor 5571, asecond thin film transistor 5572, a third thin film transistor 5573, afourth thin film transistor 5574, a fifth thin film transistor 5575, asixth thin film transistor 5576, a seventh thin film transistor 5577,and an eighth thin film transistor 5578. Each of the first thin filmtransistor 5571, the second thin film transistor 5572, the third thinfilm transistor 5573, the fourth thin film transistor 5574, the fifththin film transistor 5575, the sixth thin film transistor 5576, theseventh thin film transistor 5577, and the eighth thin film transistor5578 is an n-channel transistor and is turned on when the gate-sourcevoltage (V_(gs)) exceeds the threshold voltage (V_(th)).

Next, connection structures of the flip-flops shown in FIG. 18 will bedescribed below.

A first electrode (one of a source electrode and a drain electrode) ofthe first thin film transistor 5571 is connected to the fourth wiring5504. A second electrode (the other of the source electrode and thedrain electrode) of the first thin film transistor 5571 is connected tothe third wiring 5503.

A first electrode of the second thin film transistor 5572 is connectedto the sixth wiring 5506. A second electrode of the second thin filmtransistor 5572 is connected to the third wiring 5503.

A first electrode of the third thin film transistor 5573 is connected tothe fifth wiring 5505, and a second electrode of the third thin filmtransistor 5573 is connected to a gate electrode of the second thin filmtransistor 5572. A gate electrode of the third thin film transistor 5573is connected to the fifth wiring 5505.

A first electrode of the fourth thin film transistor 5574 is connectedto the sixth wiring 5506. A second electrode of the fourth thin filmtransistor 5574 is connected to the gate electrode of the second thinfilm transistor 5572. A gate electrode of the fourth thin filmtransistor 5574 is connected to a gate electrode of the first thin filmtransistor 5571.

A first electrode of the fifth thin film transistor 5575 is connected tothe fifth wiring 5505. A second electrode of the fifth thin filmtransistor 5575 is connected to the gate electrode of the first thinfilm transistor 5571. A gate electrode of the fifth thin film transistor5575 is connected to the first wiring 5501.

A first electrode of the sixth thin film transistor 5576 is connected tothe sixth wiring 5506. A second electrode of the sixth thin filmtransistor 5576 is connected to the gate electrode of the first thinfilm transistor 5571. A gate electrode of the sixth thin film transistor5576 is connected to the gate electrode of the second thin filmtransistor 5572.

A first electrode of the seventh thin film transistor 5577 is connectedto the sixth wiring 5506. A second electrode of the seventh thin filmtransistor 5577 is connected to the gate electrode of the first thinfilm transistor 5571. A gate electrode of the seventh thin filmtransistor 5577 is connected to the second wiring 5502. A firstelectrode of the eighth thin film transistor 5578 is connected to thesixth wiring 5506. A second electrode of the eighth thin film transistor5578 is connected to the gate electrode of the second thin filmtransistor 5572. A gate electrode of the eighth thin film transistor5578 is connected to the first wiring 5501.

Note that the point at which the gate electrode of the first thin filmtransistor 5571, the gate electrode of the fourth thin film transistor5574, the second electrode of the fifth thin film transistor 5575, thesecond electrode of the sixth thin film transistor 5576, and the secondelectrode of the seventh thin film transistor 5577 are connected isreferred to as a node 5543. The point at which the gate electrode of thesecond thin film transistor 5572, the second electrode of the third thinfilm transistor 5573, the second electrode of the fourth thin filmtransistor 5574, the gate electrode of the sixth thin film transistor5576, and the second electrode of the eighth thin film transistor 5578are connected is referred to as a node 5544.

Note that the first wiring 5501, the second wiring 5502, the thirdwiring 5503, and the fourth wiring 5504 may be referred to as a firstsignal line, a second signal line, a third signal line, and a fourthsignal line, respectively. The fifth wiring 5505 and the sixth wiring5506 may be referred to as a first power source line and a second powersource line, respectively.

In addition, the signal line driver circuit and the scan line drivercircuit can be formed using only the n-channel TFTs described inEmbodiment 1. The n-channel TFT described in Embodiment 1 has a highmobility of the transistor, and thus a driving frequency of a drivercircuit can be increased. Further, parasitic capacitance is reduced bythe source or drain region; thus, the n-channel TFT described inEmbodiment 1 has high frequency characteristics (referred to as fcharacteristics). For example, a scan line driver circuit using then-channel TFT described in Embodiment 1 can operate at high speed, andthus a frame frequency can be increased and insertion of black imagescan be realized.

In addition, when the channel width of the transistor in the scan linedriver circuit is increased or a plurality of scan line driver circuitsare provided, for example, higher frame frequency can be realized. Whena plurality of scan line driver circuits are provided, a scan linedriver circuit for driving scan lines of even-numbered rows is providedon one side and a scan line driver circuit for driving scan lines ofodd-numbered rows is provided on the opposite side; thus, an increase inframe frequency can be realized. Furthermore, the use of the pluralityof scan line driver circuits for output of signals to the same scan lineis advantageous in increasing the size of a display device.

Further, when an active matrix light-emitting display device which is anexample of a semiconductor device is manufactured, a plurality of thinfilm transistors are arranged in at least one pixel, and thus aplurality of scan line driver circuits are preferably arranged. FIG. 14Billustrates an example of a block diagram of an active matrixlight-emitting display device.

The light-emitting display device illustrated in FIG. 14B includes, overa substrate 5400, a pixel portion 5401 including a plurality of pixelseach provided with a display element, a first scan line driver circuit5402 and a second scan line driver circuit 5404 for selecting a pixel,and a signal line driver circuit 5403 for controlling a video signalinput to the selected pixel.

When the video signal input to a pixel of the light-emitting displaydevice illustrated in FIG. 14B is a digital signal, a pixel emits lightor does not emit light by switching a transistor on/off. Thus, grayscalecan be displayed using an area grayscale method or a time grayscalemethod. An area grayscale method refers to a driving method in which onepixel is divided into a plurality of sub-pixels and each sub-pixel isdriven independently based on a video signal so that grayscale isdisplayed. Further, a time grayscale method refers to a driving methodin which a period during which a pixel emits light is controlled so thatgrayscale is displayed.

Since the response time of a light-emitting element is higher than thatof a liquid crystal element or the like, the light-emitting element ismore suitable for a time grayscale method than the liquid crystalelement. Specifically, in the case of displaying with a time grayscalemethod, one frame period is divided into a plurality of sub-frameperiods. Then, in accordance with video signals, the light-emittingelement in the pixel is brought into a light-emitting state or anon-light-emitting state in each sub-frame period. By dividing one frameperiod into a plurality of sub-frame periods, the total length of timeof a period, in which a pixel actually emits light in one frame period,can be controlled by video signals so that grayscale can be displayed.

Note that in the example of the light-emitting display deviceillustrated in FIG. 14B, when two switching TFTs are arranged in onepixel, the first scan line driver circuit 5402 generates a signal whichis input to a first scan line serving as a gate wiring of one of the twoswitching TFTs, and the second scan line driver circuit 5404 generates asignal which is input to a second scan line serving as a gate wiring ofthe other of the two switching TFTs; however, one scan line drivercircuit may generate both the signal which is input to the first scanline and the signal which is input to the second scan line. In addition,for example, there is a possibility that a plurality of scan lines usedfor controlling the operation of the switching element are provided ineach pixel, depending on the number of the switching TFTs included inone pixel. In this case, one scan line driver circuit may generate allsignals that are input to the plurality of scan lines, or a plurality ofscan line driver circuits may generate signals that are input to theplurality of scan lines.

Also in the light-emitting display device, a part of a driver circuitthat can include an n-channel TFT among driver circuits can be formedover the same substrate as the thin film transistor of the pixelportion. Alternatively, the signal line driver circuit and the scan linedriver circuit can be formed using only the n-channel TFTs described inEmbodiment 1 to 7.

Moreover, the above-described driver circuit can be used for electronicpaper that drives electronic ink using an element electrically connectedto a switching element, without being limited to applications to aliquid crystal display device or a light-emitting display device. Theelectronic paper is also referred to as an electrophoretic displaydevice (an electrophoretic display) and is advantageous in that it hasthe same level of readability as plain paper, it has lower powerconsumption than other display devices, and it can be made thin andlightweight.

Electrophoretic displays can have various modes. Electrophoreticdisplays contain a plurality of microcapsules dispersed in a solvent ora solute, each microcapsule containing first particles which arepositively charged and second particles which are negatively charged. Byapplying an electric field to the microcapsules, the particles in themicrocapsules move in opposite directions to each other and only thecolor of the particles gathering on one side is displayed. Note that thefirst particles and the second particles each contain pigment and do notmove without an electric field. Moreover, the first particles and thesecond particles have different colors (which may be colorless).

Thus, an electrophoretic display is a display that utilizes a so-calleddielectrophoretic effect by which a substance having a high dielectricconstant moves to a high-electric field region. An electrophoreticdisplay device does not need to use a polarizer or a counter substrate,which is required in a liquid crystal display device, and both thethickness and weight of the electrophoretic display device can bereduced to a half of those of a liquid crystal display device.

A solution in which the above microcapsules are dispersed in a solventis referred to as electronic ink. This electronic ink can be printed ona surface of glass, plastic, cloth, paper, or the like. Furthermore, byusing a color filter or particles that have a pigment, color display canalso be achieved.

In addition, when a plurality of the above microcapsules are arranged asappropriate over an active matrix substrate so as to be interposedbetween two electrodes, an active matrix display device can becompleted, and display can be performed by application of an electricfield to the microcapsules. For example, the active matrix substrateobtained by the thin film transistors formed in accordance withEmbodiments 1 to 7 can be used. Each of the thin film transistors formedin accordance with Embodiments 1 to 7 includes the In—Sn—O-based oxidesemiconductor layer including SiO_(X) as the semiconductor layerincluding the channel formation region; and the In—Sn—O-based oxidesemiconductor layer which does not include SiO_(X), as the source andthe drain region.

Note that the first particles and the second particles in themicrocapsules may each be formed of a single material selected from aconductive material, an insulating material, a semiconductor material, amagnetic material, a liquid crystal material, a ferroelectric material,an electroluminescent material, an electrochromic material, and amagnetophoretic material, or formed of a composite material of any ofthese.

Through the above process, a highly reliable display device can bemanufactured as a semiconductor device.

This embodiment can be implemented in appropriate combination with anyof the structures described in the other embodiments.

Embodiment 9

When a thin film transistor is manufactured and used for a pixel portionand further for a driver circuit, a semiconductor device having adisplay function (also referred to as a display device) can bemanufactured. Furthermore, when a part or whole of a driver circuitusing a thin film transistor is formed over the same substrate as thatfor a pixel portion, a system-on-panel can be obtained.

The display device includes a display element. As the display element, aliquid crystal element (also referred to as a liquid crystal displayelement) or a light-emitting element (also referred to as alight-emitting display element) can be used. Light-emitting elementsinclude, in its category, an element whose luminance is controlled bycurrent or voltage, and specifically include an inorganicelectroluminescent (EL) element, an organic EL element, and the like.Furthermore, a display medium whose contrast is changed by an electriceffect, such as electronic ink, can be used.

In addition, the display device includes a panel in which the displayelement is sealed, and a module in which an IC or the like including acontroller is mounted on the panel. The present invention also relatesto an element substrate, which corresponds to one mode before thedisplay element is completed in a manufacturing process of the displaydevice, and the element substrate is provided with means for supplyingcurrent to the display element in each of a plurality of pixels.

Note that a display device in this specification means an image displaydevice, a display device, or a light source (including a lightingdevice). Furthermore, the display device also includes the followingmodules in its category: a module to which a connector such as an FPC(flexible printed circuit), a TAB (tape automated bonding) tape, or aTCP (tape carrier package) is attached; a module having a TAB tape or aTCP at the tip of which a printed wiring board is provided; and a modulein which an IC (integrated circuit) is directly mounted on a displayelement by a COG (chip on glass) method.

The appearance and a cross section of a liquid crystal display panel,which is one embodiment of a semiconductor device, will be describedwith reference to FIGS. 22A1, 22A2, and 22B. FIGS. 22A1 and 22A2 areeach a plan view of a panel in which thin film transistors 4010 and 4011described in Embodiment 1 which are formed over a first substrate 4001,and a liquid crystal element 4013 are sealed between the first substrate4001 and a second substrate 4006 with a sealant 4005. The thin filmtransistors 4010 and 4011 each include an In—Sn—O-based oxidesemiconductor layer including SiO_(X) as a semiconductor layer includinga channel formation region; and an In—Sn—O-based oxide semiconductorlayer which does not include SiO_(X), as a source region and a drainregion. FIG. 22B is a cross-sectional view taken along line M-N of FIGS.22A1 and 22A2.

The sealant 4005 is provided to surround a pixel portion 4002 and a scanline driver circuit 4004 that are provided over the first substrate4001. The second substrate 4006 is provided over the pixel portion 4002and the scan line driver circuit 4004. Therefore, the pixel portion 4002and the scan line driver circuit 4004 are sealed together with a liquidcrystal layer 4008, by the first substrate 4001, the sealant 4005, andthe second substrate 4006. A signal line driver circuit 4003 that isformed using a single crystal semiconductor film or a polycrystallinesemiconductor film over a substrate separately prepared is mounted in aregion different from the region surrounded by the sealant 4005 over thefirst substrate 4001.

Note that there is no particular limitation on the connection method ofa driver circuit which is separately formed, and a COG method, a wirebonding method, a TAB method, or the like can be used. FIG. 22A1illustrates an example of mounting the signal line driver circuit 4003by a COG method, and FIG. 22A2 illustrates an example of mounting thesignal line driver circuit 4003 by a TAB method.

The pixel portion 4002 and the scan line driver circuit 4004 providedover the first substrate 4001 each include a plurality of thin filmtransistors. FIG. 22B illustrates the thin film transistor 4010 includedin the pixel portion 4002 and the thin film transistor 4011 included inthe scan line driver circuit 4004.

As each of the thin film transistors 4010 and 4011, the thin filmtransistor described in Embodiment 1 can be used. The thin filmtransistor described in Embodiment 1 includes an In—Sn—O-based oxidesemiconductor layer including SiO_(X) as a semiconductor layer includinga channel formation region; and an In—Sn—O-based oxide semiconductorlayer which does not include SiO_(X), as a source region and a drainregion. Alternatively, the thin film transistor described in any ofEmbodiments 2 to 7 may be employed. In this embodiment, the thin filmtransistors 4010 and 4011 are n-channel thin film transistors.

In addition, the liquid crystal element 4013 includes an In—Sn—O-basedoxide semiconductor layer 4030 which does not include SiO_(X), as apixel electrode layer. The In—Sn—O-based oxide semiconductor layer 4030which does not include SiO_(X) also functions as a source region or adrain region of the thin film transistor 4010 and electrically connectsthe thin film transistor 4010 and the liquid crystal element 4013. Acounter electrode layer 4031 of the liquid crystal element 4013 isformed on the second substrate 4006. A portion where the In—Sn—O-basedoxide semiconductor layer 4030 which does not include SiO_(X) and thecounter electrode layer 4031 overlap with each other corresponds to theliquid crystal element 4013. Note that the In—Sn—O-based oxidesemiconductor layer 4030 which does not include SiO_(X) and the counterelectrode layer 4031 are respectively provided with an insulating layer4032 and an insulating layer 4033 which function as alignment films. Theliquid crystal layer 4008 is interposed between the In—Sn—O-based oxidesemiconductor layer 4030 which does not include SiO_(X) and the counterelectrode layer 4031 with the insulating layers 4032 and 4033 interposedbetween the In—Sn—O-based oxide semiconductor layer 4030 which does notinclude SiO_(X) and the counter electrode layer 4031.

Note that the first substrate 4001 and the second substrate 4006 can bemade of glass, metal (typically, stainless steel), ceramic, or plastic.As plastic, an FRP (fiberglass-reinforced plastics) plate, a PVF(polyvinyl fluoride) film, a polyester film, or an acrylic resin filmcan be used. Alternatively, a sheet with a structure in which analuminum foil is sandwiched between PVF films or polyester films can beused.

A columnar spacer denoted by reference numeral 4035 is obtained byselective etching of an insulating film and is provided in order tocontrol the distance (a cell gap) between the In—Sn—O-based oxidesemiconductor layer 4030 which does not include SiO_(X) and the counterelectrode layer 4031. Note that a spherical spacer may also be used. Thecounter electrode layer 4031 is electrically connected to a commonpotential line provided over the same substrate as the thin filmtransistor 4010. With the use of a common connection portion, thecounter electrode layer 4031 can be electrically connected to the commonpotential line through conductive particles provided between the pair ofsubstrates. Note that the conductive particles are contained in thesealant 4005.

Alternatively, a liquid crystal showing a blue phase for which analignment film is unnecessary may be used. A blue phase is one of theliquid crystal phases, which is generated just before a cholestericphase changes into an isotropic phase while the temperature ofcholesteric liquid crystal is increased. Since the blue phase is onlygenerated within a narrow range of temperatures, a liquid crystalcomposition containing a chiral agent at 5 wt % or more is used for theliquid crystal layer 4008 in order to broaden the temperature range. Theliquid crystal composition which includes a liquid crystal showing ablue phase and a chiral agent has a short response time of 10 μs to 100μs, has optical isotropy which makes the alignment process unneeded, andhas a small viewing angle dependence.

An embodiment of the present invention can also be applied to areflective liquid crystal display device or a semi-transmissive liquidcrystal display device, in addition to a transmissive liquid crystaldisplay device.

An example of the liquid crystal display device is described in which apolarizing plate is provided on the outer surface of the substrate (onthe viewer side) and a coloring layer and an electrode layer used for adisplay element are provided on the inner surface of the substrate;however, the polarizing plate may be provided on the inner surface ofthe substrate. The stack structure of the polarizing plate and thecoloring layer is not limited to that described in this embodiment andmay be set as appropriate depending on materials of the polarizing plateand the coloring layer or conditions of manufacturing steps.Furthermore, a light-blocking film functioning as a black matrix may beprovided.

In addition, in order to reduce the surface roughness of the thin filmtransistor and improve the reliability of the thin film transistor, aninsulating layer functioning as a planarization film or a protectivefilm may be formed over the thin film transistor. Note that theprotective film is provided to prevent entry of impurities contained inthe air, such as an organic substance, a metal substance, or watervapor, and is preferably a dense film. The protective film may be formedby a sputtering method to be a single layer or a stacked layer using anyof a silicon oxide film, a silicon nitride film, a silicon oxynitridefilm, a silicon nitride oxide film, an aluminum oxide film, an aluminumnitride film, an aluminum oxynitride film, and an aluminum nitride oxidefilm. Although an example in which the protective film is formed by asputtering method is described in this embodiment, an embodiment of thepresent invention is not limited to this method and a variety of methodsmay be employed.

Here, the insulating layer 4020 having a stack structure is formed asthe protective film. As a first layer of the insulating layer 4020, asilicon oxide film is formed by a sputtering method. The use of thesilicon oxide film as the protective film has the effect of preventing ahillock of an aluminum film used for the source and drain electrodelayers.

In addition, an insulating layer is formed as a second layer of theprotective film. In this embodiment, as a second layer of the insulatinglayer 4020, a silicon nitride film is formed by a sputtering method. Theuse of the silicon nitride film as the protective film can preventmobile ions such as sodium ions from entering a semiconductor region,thereby suppressing variations in electric characteristics of the TFT.

As the planarization insulating film, an organic material such aspolyimide, acrylic, benzocyclobutene, polyamide, or epoxy can be used.Other than such organic materials, it is also possible to use alow-dielectric constant material (a low-k material), a siloxane-basedresin, PSG (phosphosilicate glass), BPSG (borophosphosilicate glass), orthe like.

Note that a siloxane resin is a resin formed from a siloxane material asa starting material and having a Si—O—Si bond. As a substituent, anorganic group (e.g., an alkyl group or an aryl group) or a fluoro groupmay be used. The organic group may include a fluoro group.

There is no particular limitation on the method for forming theplanarization insulating film, and the planarization insulating film canbe formed, depending on the material, by using a sputtering method, anSOG method, a spin coating method, a dipping method, a spray coatingmethod, a droplet discharge method (e.g., an inkjet method, screenprinting, offset printing, or the like), a doctor knife, a roll coater,a curtain coater, a knife coater, or the like.

The counter electrode layer 4031 can be made of a light-transmittingconductive material such as indium oxide containing tungsten oxide,indium zinc oxide containing tungsten oxide, indium oxide containingtitanium oxide, indium tin oxide containing titanium oxide, indium tinoxide (hereinafter referred to as ITO), indium zinc oxide, or indium tinoxide to which silicon oxide is added.

A conductive composition including a conductive high molecule (alsoreferred to as a conductive polymer) can be used for the counterelectrode layer 4031. The pixel electrode made of the conductivecomposition preferably has a sheet resistance of 10000 ohms per squareor less and a transmittance of 70% or more at a wavelength of 550 nm.Furthermore, the resistivity of the conductive high molecule containedin the conductive composition is preferably 0.1 Ω·cm or less.

As the conductive high molecule, a so-called π-electron conjugatedconductive polymer can be used. For example, it is possible to usepolyaniline or a derivative thereof, polypyrrole or a derivativethereof, polythiophene or a derivative thereof, or a copolymer of two ormore kinds of them.

In addition, a variety of signals and potentials are supplied to thesignal line driver circuit 4003 that is formed separately, and the scanline driver circuit 4004 or the pixel portion 4002 from an FPC 4018.

A terminal electrode 4016 is formed from the same conductive film assource wiring layers of the thin film transistors 4010 and 4011.

The terminal electrode 4016 is electrically connected to a terminalincluded in the FPC 4018 through an anisotropic conductive film 4019.

Note that FIGS. 22A1, 22A2, and 22B illustrate an example in which thesignal line driver circuit 4003 is formed separately and mounted on thefirst substrate 4001; however, the present invention is not limited tothis structure. The scan line driver circuit may be separately formedand then mounted, or only a part of the signal line driver circuit or apart of the scan line driver circuit may be separately formed and thenmounted.

FIG. 23 illustrates an example of a liquid crystal display module whichis formed as a semiconductor device by using a TFT substrate 2600manufactured according to a manufacturing method disclosed in thisspecification.

FIG. 23 illustrates an example of a liquid crystal display module, inwhich a TFT substrate 2600 and a counter substrate 2601 are bonded toeach other with a sealant 2602, and a pixel portion 2603 including a TFTor the like, a display element 2604 including a liquid crystal layer, acoloring layer 2605 are provided between the substrates to form adisplay region. The coloring layer 2605 is necessary to perform colordisplay. In the case of the RGB system, respective coloring layerscorresponding to colors of red, green, and blue are provided forrespective pixels. Polarizing plates 2606 and 2607 and a diffusion plate2613 are provided outside the TFT substrate 2600 and the countersubstrate 2601. A light source includes a cold cathode tube 2610 and areflective plate 2611. A circuit board 2612 is connected to a wiringcircuit portion 2608 of the TFT substrate 2600 through a flexible wiringboard 2609 and includes an external circuit such as a control circuit ora power source circuit. The polarizing plate and the liquid crystallayer may be stacked with a retardation plate interposed therebetween.

For the liquid crystal display module, a TN (twisted nematic) mode, anIPS (in-plane-switching) mode, an FFS (fringe field switching) mode, anMVA (multi-domain vertical alignment) mode, a PVA (patterned verticalalignment) mode, an ASM (axially symmetric aligned micro-cell) mode, anOCB (optical compensated birefringence) mode, an FLC (ferroelectricliquid crystal) mode, an AFLC (antiferroelectric liquid crystal) mode,or the like can be used.

Through the above process, a highly reliable liquid crystal displaypanel can be manufactured as a semiconductor device.

This embodiment can be implemented in appropriate combination with anyof the structures described in the other embodiments.

Embodiment 10

An example of electronic paper will be described as a semiconductordevice.

FIG. 30 illustrates active matrix electronic paper as an example of asemiconductor device. A thin film transistor 581 used for thesemiconductor device can be manufactured in a manner similar to that ofthe thin film transistor described in Embodiment 1 and is a thin filmtransistor which includes an In—Sn—O-based oxide semiconductor layerincluding SiO_(X) as a semiconductor layer including a channel formationregion; and an In—Sn—O-based oxide semiconductor layer which does notinclude SiO_(X), as a source region and a drain region. The thin filmtransistor described in Embodiments 2 to 7 can also be used as the thinfilm transistor 581 of this embodiment.

The twisting ball display system refers to a method in which sphericalparticles each colored in black or white are arranged between electrodelayers which are used for a display element, and a potential differenceis generated between the electrode layers to control orientation of thespherical particles, so that display is performed.

The thin film transistor 581 provided over a substrate 580 is abottom-gate thin film transistor, and is in contact with anIn—Sn—O-based oxide semiconductor layer 587 which does not includeSiO_(X) and functions as a source region or a drain region and a pixelelectrode layer through an opening formed in insulating layers 585,whereby the thin film transistor 581 is electrically connected to theIn—Sn—O-based oxide semiconductor layer 587. Between the In—Sn—O-basedoxide semiconductor layer 587 which does not include SiO_(X) and anelectrode layer 588, spherical particles 589 each having a black region590 a, a white region 590 b, and a cavity 594 around the regions whichis filled with liquid are provided. A space around the sphericalparticles 589 is filled with a filler 595 such as a resin (see FIG. 30).The electrode layer 588 corresponds to a common electrode (counterelectrode). The electrode layer 588 is electrically connected to acommon potential line provided over the same substrate as that for thethin film transistor 581. With the use of a common connection portion,the electrode layer 588 can be electrically connected to the commonpotential line through conductive particles provided between a pair ofsubstrates.

Instead of the twisting ball, an electrophoretic element can also beused. A microcapsule having a diameter of approximately 10 μm to 20 μM,in which a transparent liquid and positively charged whitemicroparticles and negatively charged black microparticles areencapsulated, is used. In the microcapsule which is provided between thepixel electrode layer and the common electrode layer, when an electricfield is applied by the pixel electrode layer and the common electrodelayer, the white microparticles and the black microparticles migrate toopposite sides to each other, so that white or black can be displayed. Adisplay element using this principle is an electrophoretic displayelement and is generally called electronic paper. The electrophoreticdisplay element has higher reflectance than a liquid crystal displayelement, and thus, an auxiliary light is unnecessary, power consumptionis low, and a display portion can be recognized in a dim place. Inaddition, even when power is not supplied to the display portion, animage which has been displayed once can be maintained. Accordingly, adisplayed image can be stored even if a semiconductor device having adisplay function (which may be referred to simply as a display device ora semiconductor device provided with a display device) is distanced froman electric wave source.

Through this process, highly reliable electronic paper can bemanufactured as a semiconductor device.

This embodiment can be implemented in appropriate combination with anyof the structures described in the other embodiments.

Embodiment 11

An example of a light-emitting display device will be described as asemiconductor device. As a display element included in a display device,a light-emitting element utilizing electroluminescence is describedhere. Light-emitting elements utilizing electroluminescence areclassified according to whether a light-emitting material is an organiccompound or an inorganic compound. In general, the former is referred toas an organic EL element, and the latter is referred to as an inorganicEL element.

In an organic EL element, by application of a voltage to alight-emitting element, electrons and holes are separately injected froma pair of electrodes into a layer containing a light-emitting organiccompound, and a current flows. Then, the carriers (electrons and holes)recombine, so that the light-emitting organic compound is excited. Thelight-emitting organic compound returns to a ground state from theexcited state, thereby emitting light. Owing to such a mechanism, thislight-emitting element is referred to as a current-excitationlight-emitting element.

The inorganic EL elements are classified according to their elementstructures into a dispersion-type inorganic EL element and a thin-filminorganic EL element. The dispersion-type inorganic EL element has alight-emitting layer where particles of a light-emitting material aredispersed in a binder, and its light emission mechanism isdonor-acceptor recombination type light emission which utilizes a donorlevel and an acceptor level. The thin-film inorganic EL element has astructure where a light-emitting layer is sandwiched between dielectriclayers, which are further sandwiched between electrodes, and its lightemission mechanism is localized type light emission that utilizesinner-shell electron transition of metal ions. Note that description ismade here using an organic EL element as a light-emitting element.

FIG. 20 illustrates an example of a pixel structure as an example of asemiconductor device which can be driven by a digital time grayscalemethod.

The structure and operation of a pixel which can be driven by a digitaltime grayscale method will be described. An example is described here inwhich one pixel includes two n-channel transistors each using anIn—Sn—O-based oxide semiconductor layer including SiO_(X) for a channelformation region.

A pixel 6400 includes a switching transistor 6401, a driving transistor6402, a light-emitting element 6404, and a capacitor 6403. A gate of theswitching transistor 6401 is connected to a scan line 6406, a firstelectrode (one of a source electrode and a drain electrode) of theswitching transistor 6401 is connected to a signal line 6405, and asecond electrode (the other of the source electrode and the drainelectrode) of the switching transistor 6401 is connected to a gate ofthe driving transistor 6402. The gate of the driving transistor 6402 isconnected to a power source line 6407 through the capacitor 6403, afirst electrode of the driving transistor 6402 is connected to the powersource line 6407, and a second electrode of the driving transistor 6402is connected to a first electrode (pixel electrode) of thelight-emitting element 6404. A second electrode of the light-emittingelement 6404 corresponds to a common electrode 6408. The commonelectrode 6408 is electrically connected to a common potential lineprovided over the same substrate.

Note that the second electrode (common electrode 6408) of thelight-emitting element 6404 is set to be a low power source potential.The low power source potential is lower than a high power sourcepotential which is supplied to the power source line 6407. For example,GND, 0 V, or the like may be set as the low power source potential. Thedifference between the high power source potential and the low powersource potential is applied to the light-emitting element 6404 so that acurrent flows through the light-emitting element 6404, whereby thelight-emitting element 6404 emits light. Thus, each potential is set sothat the difference between the high power source potential and the lowpower source potential is greater than or equal to a forward thresholdvoltage of the light-emitting element 6404.

When the gate capacitance of the driving transistor 6402 is used as asubstitute for the capacitor 6403, the capacitor 6403 can be omitted.The gate capacitance of the driving transistor 6402 may be formedbetween a channel region and a gate electrode.

Here, in the case of using a voltage-input voltage-driving method, avideo signal is input to the gate of the driving transistor 6402 to makethe driving transistor 6402 completely turned on or off. That is, thedriving transistor 6402 operates in a linear region, and thus, a voltagehigher than the voltage of the power source line 6407 is applied to thegate of the driving transistor 6402. Note that a voltage greater than orequal to (power source line voltage+V_(th) of the driving transistor6402) is applied to the signal line 6405.

In the case of using an analog grayscale method instead of the digitaltime grayscale method, the same pixel structure as in FIG. 20 can beemployed by inputting signals in a different way.

In the case of using the analog grayscale driving method, a voltagegreater than or equal to (forward voltage of the light-emitting element6404+V_(th) of the driving transistor 6402) is applied to the gate ofthe driving transistor 6402. The forward voltage of the light-emittingelement 6404 refers to a voltage to obtain a desired luminance, andincludes at least a forward threshold voltage. By inputting a videosignal to enable the driving transistor 6402 to operate in a saturationregion, a current can flow through the light-emitting element 6404. Inorder that the driving transistor 6402 can operate in the saturationregion, the potential of the power source line 6407 is higher than agate potential of the driving transistor 6402. With the analog videosignal, a current in accordance with the video signal flows through thelight-emitting element 6404, and the analog grayscale driving method canbe performed.

Note that the pixel structure is not limited to that illustrated in FIG.20. For example, the pixel in FIG. 20 can further include a switch, aresistor, a capacitor, a transistor, a logic circuit, or the like.

Next, structures of the light-emitting element will be described withreference to FIGS. 21A to 21C. Here, a cross-sectional structure of apixel will be described by taking an n-channel driving TFT as anexample. Driving TFTs 7001, 7011, and 7021 used for semiconductordevices illustrated in FIGS. 21A to 21C can be manufactured in a mannersimilar to that of the thin film transistor described in Embodiment 1and are thin film transistors, each of which includes an In—Sn—O-basedoxide semiconductor layer including SiO_(X) as a semiconductor layerincluding a channel formation region; and an In—Sn—O-based oxidesemiconductor layer which does not include SiO_(X), as a source regionand a drain region. Alternatively, the thin film transistor described inEmbodiments 2 to 7 can be employed as the driving TFTs 7001, 7011, and7021.

In order to extract light emitted from the light-emitting element, atleast one of an anode and a cathode is required to transmit light. Athin film transistor and a light-emitting element are formed over asubstrate. A light-emitting element can have a top emission structure inwhich light is extracted through the surface opposite to the substrate,a bottom emission structure in which light is extracted through thesurface on the substrate side, or a dual emission structure in whichlight is extracted through the surface opposite to the substrate and thesurface on the substrate side. The pixel structure can be applied to alight-emitting element having any of these emission structures.

A light-emitting element having a top emission structure will bedescribed with reference to FIG. 21A.

FIG. 21A is a cross-sectional view of a pixel in the case where thedriving TFT 7001 is of an n-type and light is emitted from alight-emitting element 7002 to an anode 7005 side. In FIG. 21A, acathode 7003 of the light-emitting element 7002 is electricallyconnected to the driving TFT 7001. The cathode 7003, a light-emittinglayer 7004 and the anode 7005 are stacked in this order over areflective film 7006. The cathode 7003, which is formed from anIn—Sn—O-based oxide semiconductor film which does not include SiO_(X),has both functions of a source region or a drain region and a pixelelectrode layer of the TFT 7001. The cathode 7003 formed from anIn—Sn—O-based oxide semiconductor film which does not include SiO_(X)functions as an electrode of the light-emitting element 7002. Thereflective film 7006 can be formed using a variety of materials as longas they reflect light. For example, Ca, Al, CaF, MgAg, AlLi, or the likecan be given. The light-emitting layer 7004 may be formed with either asingle layer or a stacked layer of a plurality of layers. When thelight-emitting layer 7004 is formed with a plurality of layers, thelight-emitting layer 7004 is formed by stacking an electron-injectinglayer, an electron-transporting layer, a light-emitting layer, ahole-transporting layer, and a hole-injecting layer in this order overthe cathode 7003 which is formed from the In—Sn—O-based oxidesemiconductor film which does not include SiO_(X). Note that not all ofthese layers need to be provided. The anode 7005 is made of alight-transmitting conductive material such as indium oxide containingtungsten oxide, indium zinc oxide containing tungsten oxide, indiumoxide containing titanium oxide, indium tin oxide containing titaniumoxide, indium tin oxide (hereinafter referred to as ITO), indium zincoxide, or indium tin oxide to which silicon oxide is added.

The light-emitting element 7002 corresponds to a region where thelight-emitting layer 7004 is sandwiched between the cathode 7003 and theanode 7005. In the case of the pixel illustrated in FIG. 21A, light isemitted from the light-emitting element 7002 to the anode 7005 side asindicated by an arrow.

Next, a light-emitting element having a bottom emission structure willbe described with reference to FIG. 21B. FIG. 21B is a cross-sectionalview of a pixel in the case where the driving TFT 7011 is of an n-typeand light is emitted from a light-emitting element 7012 to a cathode7013 side. In FIG. 21B, a light-emitting layer 7014 and an anode 7015 ofthe light-emitting element 7012 are stacked in this order over thelight-transmitting cathode 7013 formed from an In—Sn—O-based oxidesemiconductor film which does not include SiO_(X), which is electricallyconnected to the driving TFT 7011. The cathode 7013 formed from theIn—Sn—O-based oxide semiconductor film which does not include SiO_(X),which functions as a source region or a drain region of the driving TFT7011 and a pixel electrode layer, functions as an electrode of thelight-emitting element 7012. A blocking film 7016 for reflecting orblocking light may be formed so as to cover the anode 7015 when theanode 7015 has a light-transmitting property. For the cathode 7013, asin the case of FIG. 21A, an In—Sn—O-based oxide semiconductor materialcan be used. Similarly to the case of FIG. 21A, the light-emitting layer7014 may be formed with either a single layer or a plurality of layersstacked. The anode 7015 is not required to transmit light, but can bemade of a light-transmitting conductive material like in the case ofFIG. 21A. For the blocking film 7016, a metal or the like that reflectslight can be used; however, it is not limited to a metal film. Forexample, a resin or the like to which black pigments are added can beused.

A region where the light-emitting layer 7014 is sandwiched between thecathode 7013 and the anode 7015 corresponds to the light-emittingelement 7012. In the case of the pixel illustrated in FIG. 21B, light isemitted from the light-emitting element 7012 to the cathode 7013 side asindicated by an arrow.

Next, a light-emitting element having a dual emission structure will bedescribed with reference to FIG. 21C. In FIG. 21C, a light-emittinglayer 7024 and an anode 7025 are stacked in this order over thelight-transmitting cathode 7013 formed from an In—Sn—O-based oxidesemiconductor film which does not include SiO_(X). The cathode 7013 iselectrically connected to the driving TFT 7011. For the cathode 7023, asin the case of FIG. 21A, an In—Sn—O-based oxide semiconductor materialcan be used. The cathode 7023 formed from the In—Sn—O-based oxidesemiconductor film which does not include SiO_(X), which functions as asource region or a drain region of the driving TFT 7021 and a pixelelectrode, functions as an electrode of the light-emitting element 7022.Similar to the case of FIG. 21A, the light-emitting layer 7024 may beformed as either a single layer or a plurality of layers stacked. Theanode 7025 can be formed using a light-transmitting conductive materiallike in the case of FIG. 21A.

The light-emitting element 7022 corresponds to a region where thecathode 7023, the light-emitting layer 7024, and the anode 7025 overlapwith one another. In the case of the pixel illustrated in FIG. 21C,light is emitted from the light-emitting element 7022 to both the anode7025 side and the cathode 7023 side as indicated by arrows.

Although an organic EL element is described here as a light-emittingelement, an inorganic EL element can also be provided as alight-emitting element.

Note that the example is described in which a thin film transistor (adriving TFT) which controls the driving of a light-emitting element iselectrically connected to the light-emitting element; however, astructure may be employed in which a TFT for current control isconnected between the driving TFT and the light-emitting element.

Note that the structure of the semiconductor device is not limited tothose illustrated in FIGS. 21A to 21C and can be modified in variousways based on techniques disclosed in this specification.

Next, the appearance and a cross section of a light-emitting displaypanel (also referred to as a light-emitting panel), which is oneembodiment of the semiconductor device, will be described with referenceto FIGS. 24A and 24B. FIG. 24A is a top view of a panel in which a thinfilm transistor and a light-emitting element formed over a firstsubstrate are sealed between the first substrate and a second substratewith a sealant. FIG. 24B is a cross-sectional view along line H-I ofFIG. 24A.

A sealant 4505 is provided to surround a pixel portion 4502, signal linedriver circuits 4503 a and 4503 b, and scan line driver circuits 4504 aand 4504 b, which are provided over a first substrate 4501. In addition,a second substrate 4506 is provided over the pixel portion 4502, thesignal line driver circuits 4503 a and 4503 b, and the scan line drivercircuits 4504 a and 4504 b. Accordingly, the pixel portion 4502, thesignal line driver circuits 4503 a and 4503 b, and the scan line drivercircuits 4504 a and 4504 b are sealed together with a filler 4507, bythe first substrate 4501, the sealant 4505, and the second substrate4506. It is preferable that a display device be thus packaged (sealed)with a protective film (such as a bonding film or an ultraviolet curableresin film) or a cover material with high air-tightness and littledegasification so that the display device is not exposed to the outsideair.

The pixel portion 4502, the signal line driver circuits 4503 a and 4503b, and the scan line driver circuits 4504 a and 4504 b formed over thefirst substrate 4501 each include a plurality of thin film transistors,and a thin film transistor 4510 included in the pixel portion 4502 and athin film transistor 4509 included in the signal line driver circuit4503 a are illustrated as an example in FIG. 24B.

As each of the thin film transistors 4509 and 4510, the thin filmtransistor described in Embodiment 1, includes an In—Sn—O-based oxidesemiconductor layer including SiO_(X) as a semiconductor layer includinga channel formation region; and an In—Sn—O-based oxide semiconductorlayer which does not include SiO_(X), as a source region and a drainregion, can be used. Alternatively, the thin film transistor describedin any of Embodiments 2 to 7 may be employed. The thin film transistors4509 and 4510 are n-channel thin film transistors.

In addition, the light-emitting layer 4511 includes an In—Sn—O-basedoxide semiconductor layer 4517 which does not include SiO_(X) andfunctions as a pixel electrode layer. The In—Sn—O-based oxidesemiconductor layer 4030 which does not include SiO_(X) also functionsas a source region or a drain region of the thin film transistor 4510and electrically connects the thin film transistor 4510 and thelight-emitting element 4511. Note that the structure of thelight-emitting element 4511 is, but not limited to, the stack structurewhich includes the In—Sn—O-based oxide semiconductor layer 4517 whichdoes not include SiO_(X), an electroluminescent layer 4512, and theelectrode layer 4513. The structure of the light-emitting element 4511can be changed as appropriate depending on the direction in which lightis extracted from the light-emitting element 4511, or the like.

A partition wall 4520 is made of an organic resin film, an inorganicinsulating film, or organic polysiloxane. It is particularly preferablethat the partition wall 4520 be formed of a photosensitive material tohave an opening over the In—Sn—O-based oxide semiconductor layer 4517which does not include SiO_(X) so that a sidewall of the opening isformed as an inclined surface with continuous curvature.

The electroluminescent layer 4512 may be formed as a single layer or aplurality of layers stacked.

A protective film may be formed over the electrode layer 4513 and thepartition wall 4520 in order to prevent oxygen, hydrogen, moisture,carbon dioxide, or the like from entering the light-emitting element4511. As the protective film, a silicon nitride film, a silicon nitrideoxide film, a DLC film, or the like can be formed.

A variety of signals and potentials are supplied to the signal linedriver circuits 4503 a and 4503 b, the scan line driver circuits 4504 aand 4504 b, or the pixel portion 4502 from FPCs 4518 a and 4518 b.

A terminal electrode 4516 is formed from the same conductive film assource wirings of the thin film transistors 4509 and 4510.

The terminal electrode 4516 is electrically connected to a terminal ofthe FPC 4518 a through an anisotropic conductive film 4519.

In the case where the first substrate 4501 and/or the second substrate4506 is located in the direction in which light is extracted from thelight-emitting element 4511, the first substrate 4501 and/or the secondsubstrate 4506 need/needs to have a light-transmitting property. In thatcase, a material with a light-transmitting property, such as a glassplate, a plastic sheet, a polyester film, or an acrylic film is used.

As the filler 4507, an ultraviolet curable resin or a thermosettingresin can be used, in addition to an inert gas such as nitrogen orargon. For example, PVC (polyvinyl chloride), acrylic, polyimide, anepoxy resin, a silicone resin, PVB (polyvinyl butyral), or EVA (ethylenevinyl acetate) can be used. For example, nitrogen is used for thefiller.

In addition, if needed, an optical film, such as a polarizing plate, acircularly polarizing plate (including an elliptically polarizingplate), a retardation plate (a quarter-wave plate or a half-wave plate),or a color filter, may be provided as appropriate on a light-emittingsurface of the light-emitting element. Furthermore, the polarizing plateor the circularly polarizing plate may be provided with ananti-reflection film. For example, anti-glare treatment by whichreflected light can be diffused by projections and depressions on thesurface so as to reduce the glare can be performed.

The signal line driver circuits 4503 a and 4503 b and the scan linedriver circuits 4504 a and 4504 b may be mounted as driver circuitsformed using a single crystal semiconductor film or a polycrystallinesemiconductor film over a substrate separately prepared. Alternatively,only the signal line driver circuits or part thereof, or only the scanline driver circuits or part thereof may be separately formed andmounted. This embodiment is not limited to the structure illustrated inFIGS. 24A and 24B.

Through the above process, a highly reliable light-emitting displaydevice (display panel) can be manufactured as a semiconductor device.

This embodiment can be implemented in appropriate combination with anyof the structures described in the other embodiments.

Embodiment 12

A semiconductor device disclosed in this specification can be applied toelectronic paper. Electronic paper can be used for electronic appliancesof a variety of fields as long as they display data. For example,electronic paper can be applied to an electronic book device (electronicbook), a poster, an advertisement in a vehicle such as a train, ordisplays of various cards such as a credit card. Examples of theelectronic appliances are illustrated in FIGS. 25A and 25B and FIG. 26.

FIG. 25A illustrates a poster 2631 using electronic paper. In the casewhere an advertising medium is printed paper, the advertisement isreplaced by hands; however, by using electronic paper disclosed in thisspecification, the advertising display can be changed in a short time.Furthermore, stable images can be obtained without display defects. Notethat the poster may have a configuration capable of wirelesslytransmitting and receiving data.

FIG. 25B illustrates an advertisement 2632 in a vehicle such as a train.In the case where an advertising medium is printed paper, theadvertisement is replaced by hands; however, by using electronic paperdisclosed in this specification, the advertising display can be changedin a short time with less manpower. Furthermore, stable images can beobtained without display defects. Note that the advertisement in avehicle may have a configuration capable of wirelessly transmitting andreceiving data.

FIG. 26 illustrates an example of an electronic book device 2700. Forexample, the electronic book device 2700 includes two housings, ahousing 2701 and a housing 2703. The housing 2701 and the housing 2703are combined with a hinge 2711 so that the electronic book device 2700can be opened and closed with the hinge 2711 as an axis. With such astructure, the electronic book device 2700 can operate like a paperbook.

A display portion 2705 and a display portion 2707 are incorporated inthe housing 2701 and the housing 2703, respectively. The display portion2705 and the display portion 2707 may display one image or differentimages. In the case where the display portion 2705 and the displayportion 2707 display different images, for example, text can bedisplayed on a display portion on the right side (the display portion2705 in FIG. 26) and graphics can be displayed on a display portion onthe left side (the display portion 2707 in FIG. 26).

FIG. 26 illustrates an example in which the housing 2701 is providedwith an operation portion and the like. For example, the housing 2701 isprovided with a power switch 2721, an operation key 2723, a speaker2725, and the like. With the operation key 2723, pages can be turned. Akeyboard, a pointing device, and the like may be provided on the samesurface as the display portion of the housing. Furthermore, an externalconnection terminal (an earphone terminal, a USB terminal, a terminalthat can be connected to various cables such as an AC adapter and a USBcable, or the like), a recording medium insertion portion, and the likemay be provided on the back surface or the side surface of the housing.Moreover, the electronic book device 2700 may have a function of anelectronic dictionary.

The electronic book device 2700 may have a configuration capable ofwirelessly transmitting and receiving data. Through wirelesscommunication, desired book data or the like can be purchased anddownloaded from an electronic book server.

Embodiment 13

A semiconductor device disclosed in this specification can be applied asa variety of electronic appliances (including amusement machines).Examples of electronic appliances include television sets (also referredto as televisions or television receivers), monitor of computers or thelike, cameras such as digital cameras or digital video cameras, digitalphoto frames, cellular phones (also referred to as mobile phones ormobile phone sets), portable game consoles, portable informationterminals, audio reproducing devices, large-sized game machines such aspachinko machines, and the like.

FIG. 27A illustrates an example of a television set 9600. In thetelevision set 9600, a display portion 9603 is incorporated in a housing9601. Images can be displayed on the display portion 9603. Here, thehousing 9601 is supported by a stand 9605.

The television set 9600 can be operated with an operation switch of thehousing 9601 or a separate remote controller 9610. Channels and volumecan be controlled with an operation key 9609 of the remote controller9610 so that an image displayed on the display portion 9603 can becontrolled. Furthermore, the remote controller 9610 may be provided witha display portion 9607 for displaying data output from the remotecontroller 9610.

Note that the television set 9600 is provided with a receiver, a modem,and the like. With the receiver, a general television broadcast can bereceived. Furthermore, when the television set 9600 is connected to acommunication network by wired or wireless connection via the modem,one-way (from a transmitter to a receiver) or two-way (between atransmitter and a receiver, between receivers, or the like) datacommunication can be performed.

FIG. 27B illustrates an example of a digital photo frame 9700. Forexample, in the digital photo frame 9700, a display portion 9703 isincorporated in a housing 9701. Various images can be displayed on thedisplay portion 9703. For example, the display portion 9703 can displaydata of an image shot by a digital camera or the like to function as anormal photo frame.

Note that the digital photo frame 9700 is provided with an operationportion, an external connection portion (a USB terminal, a terminal thatcan be connected to various cables such as a USB cable, or the like), arecording medium insertion portion, and the like. Although they may beprovided on the same surface as the display portion, it is preferable toprovide them on the side surface or the back surface for the design ofthe digital photo frame 9700. For example, a memory storing data of animage shot by a digital camera is inserted in the recording mediuminsertion portion of the digital photo frame, whereby the image data canbe transferred and displayed on the display portion 9703.

The digital photo frame 9700 may have a configuration capable ofwirelessly transmitting and receiving data. Through wirelesscommunication, desired image data can be transferred to be displayed.

FIG. 28A illustrates a portable amusement machine including twohousings: a housing 9881 and a housing 9891. The housings 9881 and 9891are connected with a connection portion 9893 so as to be opened andclosed. A display portion 9882 and a display portion 9883 areincorporated in the housing 9881 and the housing 9891, respectively. Inaddition, the portable amusement machine illustrated in FIG. 28Aincludes a speaker portion 9884, a recording medium insertion portion9886, an LED lamp 9890, an input means (an operation key 9885, aconnection terminal 9887, a sensor 9888 (a sensor having a function ofmeasuring force, displacement, position, speed, acceleration, angularvelocity, rotational frequency, distance, light, liquid, magnetism,temperature, chemical substance, sound, time, hardness, electric field,current, voltage, electric power, radiation, flow rate, humidity,gradient, oscillation, odor, or infrared rays), or a microphone 9889),and the like. It is needless to say that the structure of the portableamusement machine is not limited to the above and other structuresprovided with at least a semiconductor device disclosed in thisspecification can be employed. The portable amusement machine mayinclude other accessory equipment as appropriate. The portable amusementmachine illustrated in FIG. 28A has a function of reading a program ordata stored in a recording medium to display it on the display portion,and a function of sharing information with another portable amusementmachine by wireless communication. The portable amusement machineillustrated in FIG. 28A can have various functions without limitation tothe above.

FIG. 28B illustrates an example of a slot machine 9900 which is alarge-sized amusement machine. In the slot machine 9900, a displayportion 9903 is incorporated in a housing 9901. In addition, the slotmachine 9900 includes an operation means such as a start lever or a stopswitch, a coin slot, a speaker, and the like. It is needless to say thatthe structure of the slot machine 9900 is not limited to the above andother structures provided with at least a semiconductor device disclosedin this specification may be employed. The slot machine 9900 may includeother accessory equipment as appropriate.

FIG. 29A is a perspective view illustrating an example of a portablecomputer.

In the portable computer of FIG. 29A, a top housing 9301 having adisplay portion 9303 and a bottom housing 9302 having a keyboard 9304can overlap with each other by closing a hinge unit which connects thetop housing 9301 and the bottom housing 9302. The portable computer ofFIG. 29A can be convenient for carrying, and in the case of using thekeyboard for input, the hinge unit is opened and the user can inputlooking at the display portion 9303.

The bottom housing 9302 includes a pointing device 9306 with which inputcan be performed, in addition to the keyboard 9304. Further, when thedisplay portion 9303 is a touch input panel, input can be performed bytouching part of the display portion. The bottom housing 9302 includesan arithmetic function portion such as a CPU or hard disk. In addition,the bottom housing 9302 includes another device, for example, anexternal connection port 9305 into which a communication cableconformable to communication standards of a USB is inserted.

The top housing 9301, which includes a display portion 9307 and can keepthe display portion 9307 therein by sliding it toward the inside of thetop housing 9301, can have a large display screen. In addition, the usercan adjust the orientation of a screen of the display portion 9307 whichcan be kept in the top housing 9301. When the display portion 9307 whichcan be kept in the top housing 9301 is a touch input panel, input can beperformed by touching part of the display portion 9307 which can be keptin the top housing 9301.

The display portion 9303 or the display portion 9307 which can be keptin the top housing 9301 are formed using an image display device of aliquid crystal display panel, a light-emitting display panel such as anorganic light-emitting element or an inorganic light-emitting element,or the like.

In addition, the portable computer of FIG. 29A can be provided with areceiver and the like and can receive a television broadcast to displayan image on the display portion. The user can watch a televisionbroadcast when the whole screen of the display portion 9307 is exposedby sliding the display portion 9307 while the hinge unit which connectsthe top housing 9301 and the bottom housing 9302 is kept closed. In thiscase, the hinge unit is not opened and display is not performed on thedisplay portion 9303. In addition, start up of only a circuit fordisplaying a television broadcast is performed. Therefore, power can beconsumed to the minimum, which is useful for the portable computer whosebattery capacity is limited.

FIG. 29B is a perspective view illustrating an example of a cellularphone that the user can wear on the wrist like a wristwatch.

This cellular phone is formed with a main body which includes acommunication device including at least a telephone function, andbattery; a band portion which enables the main body to be wore on thewrist; an adjusting portion 9205 for adjusting the fixation of the bandportion fixed for the wrist; a display portion 9201; a speaker 9207; anda microphone 9208.

In addition, the main body includes operating switches 9203. Theoperating switches 9203 serve, for example, as a switch for starting aprogram for the Internet when the switch is pushed, in addition toserving as a switch for turning on a power source, a switch for shiftinga display, a switch for instructing to start taking images, or the like,and can be used so as to correspond to each function.

Input to this cellular phone is operated by touching the display portion9201 with a finger or an input pen, operating the operating switches9203, or inputting voice into the microphone 9208. Note that displayedbuttons 9202 which are displayed on the display portion 9201 areillustrated in FIG. 29B. Input can be performed by touching thedisplayed buttons 9202 with a finger or the like.

Further, the main body includes a camera portion 9206 including an imagepick-up means having a function of converting an image of an object,which is formed through a camera lens, to an electronic image signal.Note that the camera portion is not necessarily provided.

The cellular phone illustrated in FIG. 29B is provided with a receiverof a television broadcast and the like, and can display an image on thedisplay portion 9201 by receiving a television broadcast. In addition,the cellular phone illustrated in FIG. 29B is provided with a memorydevice and the like such as a memory, and can record a televisionbroadcast in the memory. The cellular phone illustrated in FIG. 29B mayhave a function of collecting location information such as GPS.

An image display device of a liquid crystal display panel, alight-emitting display panel such as an organic light-emitting elementor an inorganic light-emitting element, or the like is used as thedisplay portion 9201. The cellular phone illustrated in FIG. 29B iscompact and lightweight and the battery capacity of the cellular phoneillustrated in FIG. 29B is limited. Therefore, a panel which can bedriven with low power consumption is preferably used as a display devicefor the display portion 9201.

Note that FIG. 29B illustrates the electronic apparatus which is worn onthe wrist; however, this embodiment is not limited thereto as long as aportable shape is employed.

Example 1

An In—Sn—O-based oxide semiconductor film including SiO_(X) used for asemiconductor layer included in a channel formation region of a thinfilm transistor was formed. The detailed description thereof is givenbelow.

Samples A, B, and C each of which was an In—Sn—O-based oxidesemiconductor film including SiO₂ were formed by a sputtering methodusing an In—Sn—O-based oxide semiconductor target including SiO₂(In₂O₃:SnO₂:SiO₂=85:10:5 (wt %)) and the conductivity thereof wasmeasured. The formation conditions and the conductivity of the samplesA, B, and C are shown in Table 1.

TABLE 1 SAMPLE NAME SAMPLE SAMPLE SAMPLE A B C FORMATION POWER 3.2 3.23.2 CONDITOINS SUPPLY [kW] PRESSURE [Pa] 0.16 0.23 0.15 FLOW RATE 72 5030 OF ARGON [sccm] FLOW RATE OF 3 20 20 OXYGEN [sccm] PROPORTION OF 4 2940 OXYGEN FLOW RATE [%] CONDUCTIVITY [S/cm] 4.20E+01 3.76E−07 9.25E−10

In Table 1, the proportion of an oxygen flow rate is obtained bydividing an oxygen flow rate flowing at the time of film formation bythe whole flow rate of oxygen flow and argon. As shown in Table 1, theconductivity of the sample A formed at 4% of the oxygen flow rate was4.20 E+01(4.20×10) S/cm, the conductivity of the sample B formed at 29%of the oxygen flow rate was 3.76 E−07(3.73×10⁻⁷) S/cm, and theconductivity of the sample C formed at 40% of the oxygen flow rate was9.25 E-10(9.25×10⁻¹⁰) S/cm.

According to the above results of computation, as for the thin filmtransistor in which an In—Sn—O-based oxide semiconductor layer includingSiO_(X) is used as a semiconductor layer including a channel formationregion, the semiconductor layer preferably has a conductivity less thanor equal to 1.6×10⁻³ S/cm, or more preferably less than or equal to1.3×10⁻⁴ S/cm.

Thus, since the In—Sn—O-based oxide semiconductor films including SiO₂of the sample B and the sample C each has a low conductivity of lessthan or equal to 1.3×10⁻⁴ S/cm, a thin film transistor having excellentelectrical characteristics can be manufactured using the In—Sn—O-basedoxide semiconductor film including SiO₂ of the sample B or the sample C.

This application is based on Japanese Patent Application serial no.2009-026482 filed with Japan Patent Office on Feb. 6, 2009, the entirecontents of which are hereby incorporated by reference.

1. A method of manufacturing a semiconductor device, comprising: forminga gate electrode layer over a substrate having an insulating surface;forming a gate insulating layer over the gate electrode layer; forming afirst oxide semiconductor layer including In, Sn, and SiO_(X) over thegate insulating layer by a sputtering method using a first oxidesemiconductor target including In, Sn, Si and O at 5 wt % or higher and50 wt % or lower; and forming a source region, a drain region, and apixel electrode over the first oxide semiconductor layer by a sputteringmethod using a second oxide semiconductor target including In, Sn, Siand O, wherein the source region, the drain region, and the pixelelectrode are formed from a second oxide semiconductor layer includingIn, Sn and O.
 2. A method of manufacturing a semiconductor deviceaccording to claim 1 wherein a channel region is formed in the firstoxide semiconductor layer.